Single mask set used for interposer fabrication of multiple products

Abstract

A method for fabricating an interposer wafer includes providing at least one mask having printing regions for forming a plurality of interposer designs; selecting an interposer design; and forming the interposer design on a substrate using a plurality of lithographic imaging steps. For each lithographic imaging step, at least one portion of the interposer design is printed by exposing at least one of the printing regions while blocking at least one other of the printing regions.

What is claimed is: 
     
       1. A method of fabricating an interposer, comprising:
 providing at least one mask including a first mask, the first mask having a plurality of printing regions for forming a plurality of different interposer wafers; 
 selecting one or more printing regions of the plurality of printing regions to form an interposer wafer of the plurality of different interposer wafers; 
 forming the interposer wafer using a plurality of lithographic imaging steps where, for each lithographic imaging step, at least one portion of the interposer wafer is printed by exposing at least one of the selected printing regions to light while blocking at least one other of the printing regions from the light; and 
 forming, using one or more of the plurality of printing regions of the first mask, a different interposer wafer using a different plurality of lithographic imaging steps. 
 
     
     
       2. The method of  claim 1 , wherein the printing regions include a top printing region, a center printing region, and a bottom printing region, and wherein the step of forming comprises:
 printing, in a first lithographic imaging step, a top portion of the interposer wafer by exposing the top printing region while blocking the center and bottom printing regions. 
 
     
     
       3. The method of  claim 2 , wherein the step of forming further comprises:
 printing, in a second lithographic imaging step, a center portion of the interposer wafer by exposing the center printing region while blocking the top and bottom printing regions. 
 
     
     
       4. The method of  claim 3 , wherein the step of forming further comprises:
 printing, in a third lithographic imaging step, a bottom portion of the interposer wafer by exposing the bottom printing region while blocking the top and center printing regions. 
 
     
     
       5. The method of  claim 4 , wherein the step of forming further comprises:
 printing, in at least a fourth imaging step, at least a second center portion of the interposer wafer by exposing the center printing region while blocking the top and bottom printing regions. 
 
     
     
       6. The method of  claim 1 , wherein, for each lithographic imaging step, features of at least one portion of the interposer wafer are interconnected with features of at least one other portion of the interposer wafer. 
     
     
       7. The method of  claim 6 , wherein the features comprise conductors. 
     
     
       8. The method of  claim 6 , wherein the features comprise a die seal ring. 
     
     
       9. A method of forming an interposer wafer comprising:
 printing, in a first lithographic imaging step, at least one portion of an interposer wafer by exposing at least one printing region of at least one mask to light while blocking at least one other printing region from the light; and 
 printing, in a second lithographic imaging step, at least one additional portion of the interposer wafer by exposing at least one printing region of the at least one mask to light while blocking at least one other printing region from the light; wherein:
 the printing regions include a top printing region, a center printing region, and a bottom printing region; and 
 the first lithographic imaging step comprises printing a top portion of the interposer wafer by exposing the top printing region while blocking the center and bottom printing regions. 
 
 
     
     
       10. The method of  claim 9 , wherein the second lithographic imaging step comprises:
 printing a center portion of the interposer wafer by exposing the center printing region while blocking the top and bottom printing regions. 
 
     
     
       11. The method of  claim 10 , further comprising:
 printing, in a third lithographic imaging step, a bottom portion of the interposer wafer by exposing the bottom printing region while blocking the top and center printing regions. 
 
     
     
       12. The method of  claim 11 , further comprising:
 printing, in at least a fourth lithographic imaging step, at least a second center portion of the interposer wafer by exposing the center printing region while blocking the top and bottom printing regions. 
 
     
     
       13. The method of  claim 9 , wherein, for each lithographic imaging step, features of at least one portion of the interposer wafer are interconnected with features of at least one other portion of the interposer wafer. 
     
     
       14. An apparatus configured to fabricate an interposer, comprising:
 a lithographic imaging system configured to form the interposer on a substrate using at least one mask having printing regions for forming a plurality of different interposer wafers, the lithographic imaging system including a processor programmed to: 
 select one or more printing regions of the plurality of printing regions to form a first interposer wafer of the plurality of different interposer wafers; 
 form the first interposer wafer using a first plurality of lithographic imaging steps; 
 wherein, for each lithographic imaging step of the first plurality of lithographic imaging steps, at least one portion of the first interposer wafer is printed by exposing at least one of the selected printing regions to light while blocking at least one other of the printing regions from the light; 
 select one or more printing regions of the plurality of printing regions to form a second interposer wafer of the plurality of different interposer wafers; and 
 form the second interposer wafer using a second plurality of lithographic imaging steps that are different than first plurality of lithographic imaging steps. 
 
     
     
       15. The apparatus of  claim 14 , wherein:
 the printing regions include a top printing region, a center printing region, and a bottom printing region; and 
 the plurality of lithographic imaging steps comprises printing, in a first lithographic imaging step, a top portion of the first interposer wafer by exposing the top printing region while blocking the center and bottom printing regions. 
 
     
     
       16. The apparatus of  claim 15 , wherein the plurality of lithographic imaging steps further comprises:
 printing, in a second lithographic imaging step, a bottom portion of the first interposer wafer by exposing the bottom printing region while blocking the top and center printing regions. 
 
     
     
       17. The apparatus of  claim 16 , wherein the plurality of lithographic imaging steps further comprises:
 printing, in at least a third lithographic imaging step, at least one center portion of the first interposer wafer by exposing the center printing region while blocking the top and bottom printing regions. 
 
     
     
       18. An interposer mask comprising:
 a first printing region having a first image for lithographic imaging of a first circuit portion; 
 a second printing region having a second image for lithographic imaging of a second circuit portion; 
 a third printing region having a third image for lithographic imaging of a third circuit portion; and 
 wherein the second circuit portion of the second printing region is configured to electrically connect the first and third circuit portions when imaging a first interposer, and to electrically connect a previously imaged second circuit portion and the third circuit portion when imaging a second interposer; and 
 
       forming, a first light blocking region separating the first and second printing regions; and 
       a second light blocking region separating the second and third printing regions.