Waterborne adhesives
Abstract
Provided is an adhesive composition comprising a continuous aqueous medium and further comprising (i) particles of a polymer dispersed in said aqueous medium; and (ii) particles comprising fatty amide and one or more fatty acid, wherein 50 mole % or more of said fatty acid is in the carboxylate form, and wherein the weight ratio of said fatty amide to said fatty acid is from 0.12:1 to 2.3:1, wherein said particles comprising fatty amide and one or more fatty acid are dispersed in said aqueous medium. Also provided is a method of bonding substrates using such an adhesive composition and a bonded structure made by such a method.
Claims
exact text as granted — not AI-modifiedThe invention claimed is:
1. An adhesive composition comprising a continuous aqueous medium and further comprising
(i) particles of a polymer dispersed in said aqueous medium; and
(ii) particles comprising fatty amide and one or more fatty acid, wherein 50 mole % or more of said fatty acid is in the carboxylate form, and wherein the weight ratio of said fatty amide to said fatty acid is from 0.12:1 to 2.3:1, wherein said particles comprising fatty amide and one or more fatty acid are dispersed in said aqueous medium, and wherein the amount of fatty amide is 0.1% to 5% by weight based on the dry weight of the polymer.
2. The adhesive composition of claim 1 , wherein said fatty amide comprises erucamide.
3. The adhesive composition of claim 1 , wherein said polymer is a vinyl polymer.
4. A method of bonding a first substrate to a second substrate, wherein said method comprises
(a) applying a layer of the composition of claim 1 to a surface of said first substrate,
(b) drying said layer of the composition of claim 1 to remove water, and
(c) contacting a surface of said second substrate to said layer,
wherein one or both of said first substrate and said second substrate comprises one or more slip agent.
5. A bonded structure formed by the method of claim 4 .Join the waitlist — get patent alerts
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