Organic EL device

Abstract

According to one embodiment, an organic EL device includes an insulating substrate including a first main surface and a second main surface, a switching element formed on the insulating substrate at the first main surface side, a first electrode electrically connected to the switching element, a second electrode opposed to the first electrode, an organic luminescent layer disposed between the first electrode and the second electrode, a reflective plate disposed between the insulating substrate and the first electrode, and a conductive film covering the second main surface of the insulating substrate.

What is claimed is: 
     
       1. An organic EL device comprising:
 an insulating substrate including a first main surface and a second main surface; 
 a switching element formed on the insulating substrate at the first main surface side; 
 a first electrode electrically connected to the switching element; 
 a second electrode opposed to the first electrode; 
 an organic luminescence layer disposed between the first electrode and the second electrode; 
 a reflective plate disposed between the insulating substrate and the first electrode; 
 a conductive film covering the second main surface of the insulating substrate; 
 an insulating cover covering the conductive film; and 
 a flexible printed circuit board mounted on a first main surface side of the insulating substrate directly above the conductive film. 
 
     
     
       2. The organic EL device of  claim 1 , wherein the conductive film contains a high-melting-point metal. 
     
     
       3. The organic EL device of  claim 1 , wherein the conductive film is formed of a nitride. 
     
     
       4. The organic EL device of  claim 1 , wherein the conductive film is formed of a high-melting-point metal nitride. 
     
     
       5. The organic EL device of  claim 1 , wherein the insulating substrate is formed of a resin material. 
     
     
       6. The organic EL device of  claim 1 , wherein the reflective plate is disposed between the switching element and the first electrode. 
     
     
       7. The organic EL device of  claim 1 , wherein the insulating cover extends directly below the flexible printed circuit board. 
     
     
       8. The organic EL device of  claim 1 , further comprising a driving IC chip mounted on the first main surface side of the insulating substrate directly above the conductive film. 
     
     
       9. The organic EL device of  claim 8 , wherein the insulating cover extends directly below the flexible printed circuit board and the driving IC chip. 
     
     
       10. The organic EL device of  claim 1 , further comprising a counter-substrate opposed to the first main surface of the insulating substrate, and not opposed to the flexible printed circuit board,
 wherein the conductive film continuously extends from a position which overlaps the counter-substrate to a position which overlaps the flexible printed circuit board.