Printed circuit board and electronic device

Abstract

The present disclosure relates to the field of circuits, and provides a printed circuit board (PCB) and an electronic device. The PCB includes a substrate and a wiring layer arranged at the substrate. The wiring layer includes a digital region and an analog region, and a gap region is defined between the digital region and the analog region. The substrate is provided with a hole in the gap region, and the digital region and the analog region of the wiring layer are connected through a magnetic bead.

What is claimed is: 
     
       1. A printed circuit board (PCB), comprising a substrate and a wiring layer arranged at the substrate;
 wherein the wiring layer comprises a digital region and an analog region, and a gap region is defined between the digital region and the analog region; the substrate is provided with a plurality of holes in the gap region, and the digital region and the analog region of the wiring layer are connected through a plurality of magnetic beads; 
 wherein the plurality of holes and the plurality of magnetic beads are alternately arranged along an extending direction of the gap region. 
 
     
     
       2. The PCB according to  claim 1 , further comprising a capacitor which connects the digital region with the analog region of the wiring layer; wherein the capacitor is arranged between adjacent holes. 
     
     
       3. The PCB according to  claim 2 , wherein at least one of the plurality of magnetic beads and the capacitor is arranged between adjacent holes. 
     
     
       4. The PCB according to  claim 1 , further comprising a ground layer and a power layer which are stacked with the wiring layer; wherein the wiring layer comprises a top wiring layer and a bottom wiring layer, and the ground layer and the power layer are arranged between the top wiring layer and the bottom wiring layer. 
     
     
       5. The PCB according to  claim 4 , wherein the ground layer comprises a first region corresponding to the digital region and a second region corresponding to the analog region; the power layer comprises a third region corresponding to the digital region and a fourth region corresponding to the analog region; the first region has an area larger than that of the third region, and the second region has an area larger than that of the fourth region. 
     
     
       6. The PCB according to  claim 4 , wherein the ground layer is provided with via holes penetrating through the wiring layer, the ground layer and the power layer at positions of the first region and the second region close to the gap region, respectively. 
     
     
       7. The PCB according to  claim 4 , wherein a distance between the power layer and the gap region is greater than or equal to 0.5 mm, and a distance between the power layer and a periphery of the PCB is greater than or equal to 0.5 mm. 
     
     
       8. The PCB according to  claim 1 , wherein each of the plurality of holes has a width greater than 1 mm and a length greater than 3 mm. 
     
     
       9. The PCB according to  claim 1 , wherein a distance within the gap region between the digital region and the analog region of the wiring layer is greater than or equal to 0.5 mm. 
     
     
       10. The electronic device according to  claim 1 , wherein each of the plurality of holes has a width greater than 1 mm and a length greater than 3 mm. 
     
     
       11. The electronic device according to  claim 1 , wherein a distance within the gap region between the digital region and the analog region of the wiring layer is greater than or equal to 0.5 mm. 
     
     
       12. An electronic device, comprising a printed circuit board (PCB);
 wherein the PCB comprises a substrate and a wiring layer arranged at the substrate; 
 wherein the wiring layer comprises a digital region and an analog region, and a gap region is defined between the digital region and the analog region; the substrate is provided with a plurality of holes in the gap region, and the digital region and the analog region of the wiring layer are connected through a plurality of magnetic beads; 
 wherein the plurality of holes and the plurality of magnetic beads are alternately arranged along an extending direction of the gap region. 
 
     
     
       13. The electronic device according to  claim 12 , wherein the PCB further comprises a capacitor which connects the digital region with the analog region of the wiring layer; wherein the capacitor is arranged between adjacent holes. 
     
     
       14. The electronic device according to  claim 13 , wherein at least one of the plurality of magnetic beads and the capacitor is arranged between adjacent holes. 
     
     
       15. The electronic device according to  claim 12 , wherein the PCB further comprises a ground layer and a power layer which are stacked with the wiring layer; wherein the wiring layer comprises a top wiring layer and a bottom wiring layer, and the ground layer and the power layer are arranged between the top wiring layer and the bottom wiring layer. 
     
     
       16. The electronic device according to  claim 15 , wherein the ground layer comprises a first region corresponding to the digital region and a second region corresponding to the analog region; the power layer comprises a third region corresponding to the digital region and a fourth region corresponding to the analog region; the first region has an area larger than that of the third region, and the second region has an area larger than that of the fourth region. 
     
     
       17. The electronic device according to  claim 15 , wherein the ground layer is provided with via holes penetrating through the wiring layer, the ground layer and the power layer at positions of the first region and the second region close to the gap region, respectively. 
     
     
       18. The electronic device according to  claim 15 , wherein a distance between the power layer and the gap region is greater than or equal to 0.5 mm, and a distance between the power layer and a periphery of the PCB is greater than or equal to 0.5 mm.