US9446487B2ActiveUtilityA1

Heat sink structure with a vapor-permeable membrane for two-phase cooling

Assignee: IBMPriority: Jul 25, 2011Filed: Dec 13, 2013Granted: Sep 20, 2016
Est. expiryJul 25, 2031(~5 yrs left)· nominal 20-yr term from priority
H05K 7/20772G06F 1/20F28D 15/0266F28F 13/00F28F 3/12F28F 3/00H05K 7/20272Y10T29/4935B23P 15/26H05K 7/2029H05K 7/20254
81
PatentIndex Score
2
Cited by
119
References
4
Claims

Abstract

A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A method of facilitating extraction of heat from a heat generating electronic component, the method comprising:
 providing a heat sink comprising:
 a thermally conductive structure comprising at least one coolant-carrying channel; 
 a membrane structure associated with the at least one coolant-carrying channel, the membrane structure comprising at least one vapor-permeable region, at least a portion of the at least one vapor-permeable region overlying a portion of the at least one coolant-carrying channel and facilitating removal of vapor from the at least one coolant-carrying channel, and the membrane structure further comprising at least one orifice coupled to inject coolant onto at least one surface of the at least one coolant-carrying channel intermediate ends of the at least one coolant-carrying channel; 
 at least one plate mask associated with the membrane structure and defining a multilayer structure, the at least one plate mask comprising at least one opening aligned to at least a portion of the at least one vapor-permeable region of the membrane structure and defining at least one vapor-permeable region of the multilayer structure; 
 at least one vapor transport channel in fluid communication with the at least one vapor-permeable region of the membrane structure, the at least one vapor transport channel facilitating exhausting of vapor egressing across the at least one vapor-permeable region of the membrane structure from the at least one coolant-carrying channel; 
 at least one coolant exhaust channel in fluid communication with the at least one coolant-carrying channel and facilitating exhausting of coolant from the at least one coolant-carrying channel; 
 wherein the at least one vapor transport channel is in fluid communication with the at least one coolant exhaust channel within the heat sink, and wherein the heat sink comprises an outlet port exhausting coolant from the at least one coolant exhaust channel and vapor from the at least one vapor transport channel; and 
 
 coupling the heat sink to the at least one heat generating electronic component so that heat generated by the at least one heat generating electronic component is dissipated to coolant within the at least one coolant-carrying channel of the heat sink, wherein vapor generated within the at least one coolant-carrying channel can exhaust from the at least one coolant-carrying channel across the at least one vapor-permeable region of the membrane structure. 
 
     
     
       2. The method of  claim 1 , wherein the membrane structure comprises a liquid-impermeable membrane, and the at least one coolant-carrying channel comprises at least one coolant-carrying microchannel having a characteristic dimension less than 1.0 mm. 
     
     
       3. The method of  claim 1 , wherein the multilayer structure further comprises at least one vapor-impermeable region, the at least one vapor-impermeable region comprising the at least one orifice coupled to inject coolant into the at least one coolant-carrying channel. 
     
     
       4. The method of  claim 1 , wherein coolant within the at least one coolant-carrying channel comprises water, and wherein the membrane structure comprises a hydrophobic membrane.

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