Reusable encapsulation layer support plate and method of encapsulating OLED substrate

Abstract

The embodiments of the present invention disclose a reusable encapsulation layer support plate comprising: a support plate body, the top of the support plate body being arranged with at least one first opening for accommodating an encapsulation layer; a cavity arranged within the support plate body, the cavity being filled with a porous material, and the top of the cavity having at least one second opening; wherein the first opening is connected with and arranged opposite to the second opening, and the top surface of the porous material is parallel and level with the bottom surface of the first opening. The encapsulation layer support plate can avoid crash of OLED substrate, realize effective OLED encapsulation, and can be reused as far as possible. The embodiments of the present invention further disclose a method of encapsulating an OLED substrate using the encapsulation layer support plate.

The invention claimed is: 
     
       1. A reusable encapsulation layer support plate, wherein the encapsulation layer support plate comprises:
 a support plate body, the top of the support plate body being arranged with at least one first opening for accommodating an encapsulation layer; 
 a cavity arranged within the support plate body, the cavity being filled with a porous material, and the top of the cavity having at least one second opening; 
 wherein the first opening is connected with and arranged opposite to the second opening, and the top surface of the porous material is parallel and level with the bottom surface of the first opening. 
 
     
     
       2. The reusable encapsulation layer support plate as claimed in  claim 1 , further comprising a rubber membrane which surrounds the periphery of the bottom surface. 
     
     
       3. The reusable encapsulation layer support plate as claimed in  claim 2 , wherein at least one of the thickness of the rubber membrane is 0.1˜1 mm, and the width of the rubber membrane is 1˜5 mm. 
     
     
       4. The reusable encapsulation layer support plate as claimed in  claim 1 , wherein the area of the first opening is larger than the area of the second opening. 
     
     
       5. The reusable encapsulation layer support plate as claimed in  claim 1 , wherein at least one of the support plate body and the porous material is made from at least one of a plastic and a resin material. 
     
     
       6. The reusable encapsulation layer support plate as claimed in  claim 1 , wherein the diameter of holes in the porous material is 0.1˜1 mm. 
     
     
       7. The reusable encapsulation layer support plate as claimed in  claim 1 , wherein the depth of the first opening is less than or equal to the thickness of the encapsulation layer, and the difference value between the depth and the thickness is within a range of 0˜0.05 mm. 
     
     
       8. A method of encapsulating an OLED substrate applying a reusable encapsulation layer support plate, wherein the encapsulation layer support plate comprises:
 a support plate body, the top of the support plate body being arranged with at least one first opening for accommodating an encapsulation layer; 
 a cavity arranged within the support plate body, the cavity being filled with a porous material, and the top of the cavity having at least one second opening; 
 wherein the first opening is connected with and arranged opposite to the second opening, and the top surface of the porous material is parallel and level with the bottom surface of the first opening; 
 wherein the method comprises the steps of: 
 placing the encapsulation layer support plate and a corresponding encapsulation layer into an encapsulation layer chamber; 
 decompressing the encapsulation layer chamber; 
 putting the encapsulation layer in the first opening of the encapsulation layer support plate; 
 inflating the encapsulation layer chamber to atmosphere pressure such that the encapsulation layer is adsorbed on the encapsulation layer support plate; 
 placing an OLED substrate on the encapsulation layer support plate, and encapsulating the encapsulation layer to the OLED substrate; 
 placing the OLED substrate encapsulated with the encapsulation layer and the encapsulation layer support plate into the encapsulation layer chamber; and 
 decompressing the encapsulation layer chamber such that the encapsulation layer is separated from the encapsulation layer support plate. 
 
     
     
       9. A method of encapsulating an OLED substrate applying a reusable encapsulation layer support plate, wherein the encapsulation layer support plate comprises:
 a support plate body, the top of the support plate body being arranged with at least one first opening for accommodating an encapsulation layer; 
 a cavity arranged within the support plate body, the cavity being filled with a porous material, and the top of the cavity having at least one second opening; 
 wherein the first opening is connected with and arranged opposite to the second opening, and the top surface of the porous material is parallel and level with the bottom surface of the first opening; 
 wherein the method comprises the steps of: 
 putting the encapsulation layer in the first opening of the encapsulation layer support plate; 
 placing the encapsulation layer support plate and the encapsulation layer into the encapsulation layer chamber; 
 decompressing the encapsulation layer chamber; 
 inflating the encapsulation layer chamber to atmosphere pressure such that the encapsulation layer is adsorbed on the encapsulation layer support plate; 
 placing an OLED substrate on the encapsulation layer support plate, and encapsulating the encapsulation layer to the OLED substrate; 
 placing the OLED substrate encapsulated with the encapsulation layer and the encapsulation layer support plate into the encapsulation layer chamber; and 
 decompressing the encapsulation layer chamber such that the encapsulation layer is separated from the encapsulation layer support plate. 
 
     
     
       10. A method of encapsulating an OLED substrate applying a reusable encapsulation layer support plate, wherein the encapsulation layer support plate comprises:
 a support plate body, the top of the support plate body being arranged with at least one first opening for accommodating an encapsulation layer; 
 a cavity arranged within the support plate body, the cavity being filled with a porous material, and the top of the cavity having at least one second opening; 
 wherein the first opening is connected with and arranged opposite to the second opening, and the top surface of the porous material is parallel and level with the bottom surface of the first opening; 
 wherein the method comprises the steps of: 
 placing the encapsulation layer support plate and a corresponding encapsulation layer into an encapsulation layer chamber; 
 putting the encapsulation layer in the first opening of the encapsulation layer support plate; 
 decompressing the encapsulation layer chamber; 
 inflating the encapsulation layer chamber to atmosphere pressure such that the encapsulation layer is adsorbed on the encapsulation layer support plate; 
 placing an OLED substrate on the encapsulation layer support plate, and encapsulating the encapsulation layer to the OLED substrate; 
 placing the OLED substrate encapsulated with the encapsulation layer and the encapsulation layer support plate into the encapsulation layer chamber; and 
 decompressing the encapsulation layer chamber such that the encapsulation layer is separated from the encapsulation layer support plate.