US9365693B2ActiveUtilityA1

Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer

Assignee: MITSUBISHI ENG PLASTICS CORPPriority: Mar 23, 2012Filed: Mar 15, 2013Granted: Jun 14, 2016
Est. expiryMar 23, 2032(~5.7 yrs left)· nominal 20-yr term from priority
H05K 3/105C08L 77/06C08K 2003/2241H05K 1/0373H05K 2201/0209H05K 2201/09118C23C 18/32H05K 2201/0293C08K 9/02C08K 7/14H05K 2203/107C08K 2003/2231C23C 18/38C08K 3/40C23C 18/1608C08L 91/06C23C 18/1612C23C 18/42H05K 2203/0723C23C 18/204C08K 3/2279H05K 2201/10106F21V 7/22H05K 2201/0254H05K 2201/0347H05K 2201/0245C08L 101/12H05K 2201/0129C08L 23/06H05K 2201/2054C23C 18/1641H05K 2201/0221C08K 3/22C08K 3/00
81
PatentIndex Score
5
Cited by
30
References
24
Claims

Abstract

Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. A thermoplastic resin composition comprising:
 per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; 
 (B) 10 to 80 parts by weight of a glass filler; 
 (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and 
 (D) 20 to 150 parts by weight of titanium oxide, 
 wherein the crystalline thermoplastic resin is a polyamide resin, the polyamide resin contains a diamine structural unit and a dicarboxylic acid structural unit, and 50 mol % or more of the diamine structural unit is derived from xylylene diamine. 
 
     
     
       2. The thermoplastic resin composition of  claim 1 ,
 wherein the (C) laser direct structuring additive contains antimony and tin, with a content of tin larger than that of antimony. 
 
     
     
       3. The thermoplastic resin composition of  claim 1 ,
 wherein the (C) laser direct structuring additive contains antimony and tin oxide, with a content of tin larger than that of antimony. 
 
     
     
       4. The thermoplastic resin composition of  claim 1 ,
 wherein the (C) laser direct structuring additive has a core composed of a composition having a reflectance at 450 nm of 50% or above, and has a coating composed of a composition containing antimony and tin, with a content of tin larger than that of antimony, formed on a part of, or over the entire surface of the core. 
 
     
     
       5. The thermoplastic resin composition of  claim 4 ,
 wherein the composition composing the core contains a metal oxide. 
 
     
     
       6. The thermoplastic resin composition of  claim 1 ,
 further comprising 1 to 20 parts by weight of talc per 100 parts by weight of the thermoplastic resin composition. 
 
     
     
       7. The thermoplastic resin composition of  claim 1 ,
 wherein the (D) titanium oxide has an average primary particle size of 1 μm or smaller. 
 
     
     
       8. The thermoplastic resin composition of  claim 1 ,
 wherein the (D) titanium oxide has the rutile structure. 
 
     
     
       9. The thermoplastic resin composition of  claim 1 ,
 wherein the (B) glass filler is at least one material selected from chopped fiber, milled fiber, flake, bead and balloon. 
 
     
     
       10. The thermoplastic resin composition of  claim 1 ,
 wherein the (B) glass filler is E-glass. 
 
     
     
       11. The thermoplastic resin composition of  claim 1 , further comprising 0.01 to 5 parts by weight of an organic or/and inorganic heat stabilizer per 100 parts by weight of the thermoplastic resin composition. 
     
     
       12. The thermoplastic resin composition of  claim 11 , wherein the organic or/and inorganic heat stabilizer is substantially free from copper element. 
     
     
       13. The thermoplastic resin composition of  claim 1 , further comprising 0.01 to 5 parts by weight of an organic or/and inorganic light stabilizer per 100 parts by weight of the thermoplastic resin composition. 
     
     
       14. The thermoplastic resin composition of  claim 1 ,
 wherein the (A) crystalline thermoplastic resin contains in a molecule thereof an aromatic ring, with a ratio of carbon atoms composing the aromatic ring relative to the polyamide resin molecule of 30 mol % or more. 
 
     
     
       15. A resin article obtained by molding the thermoplastic composition described in  claim 1 . 
     
     
       16. The resin article of  claim 15 , further comprising a plated layer formed on the surface of the resin article. 
     
     
       17. A light emitting diode comprising the resin article  claim 15 . 
     
     
       18. The light emitting diode of  claim 17 , wherein the resin article functions as a reflective plate. 
     
     
       19. The resin article of  claim 16 ,
 wherein the plated layer performs as an electro-conductive circuit. 
 
     
     
       20. A method of manufacturing a resin article with a plated layer, comprising irradiating the surface of the resin article, obtained by molding the thermoplastic resin composition described in  claim 1 , with a laser, and then applying a metal to form the plated layer. 
     
     
       21. The method of manufacturing a resin article with a plated layer of  claim 20 , wherein the plated layer contains at least one kind selected from, copper, nickel, silver and gold. 
     
     
       22. The method of manufacturing a resin article with a plated layer of  claim 21 , wherein the plated layer is used in the form of multi-layered structure. 
     
     
       23. A method of manufacturing a part for a light emitting diode device having an electro-conductive circuit, comprising the method of manufacturing a resin article with a plated layer described in  claim 20 . 
     
     
       24. A thermoplastic resin composition comprising:
 per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; 
 (B) 10 to 80 parts by weight of a glass filler; 
 (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and 
 (D) 20 to 150 parts by weight of titanium oxide, 
 wherein the (C) laser direct structuring additive contains antimony and tin.

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