RFID chip module

Abstract

A chip module comprises a carrier, having a first main surface and a second main surface opposite to the first main surface. A first recess structure is arranged in the carrier in the first main surface, and a chip is arranged in the first recess structure of the carrier. A patterned metallization layer is deposited on the second main surface of the carrier, the metallization layer having a first metallization structure and a second metallization structure, the first metallization structure being electrically isolated from the second metallization structure. The chip is electrically connected to the first metallization structure and the second metallization structure. The chip module comprises in particular an RFID chip and is suited to be connected to a textile substrate by way of laser reflow soldering.

The invention claimed is:  
     
       1. A chip module, comprising:
 a carrier, having a first main surface and a second main surface opposite to the first main surface; 
 a first recess structure arranged in the carrier in the first main surface; 
 a chip arranged in the first recess structure of the carrier; and 
 a patterned metallization layer deposited on the second main surface of the carrier, the metallization layer having a first metallization structure and a second metallization structure, the first metallization structure being electrically isolated from the second metallization structure, 
 wherein the chip is electrically connected to the first metallization structure and the second metallization structure, and 
 wherein the chip module further comprises a photoresist layer being arranged between the metallization layer and the carrier. 
 
     
     
       2. The chip module according to  claim 1 , wherein the carrier comprises a material which is transparent to visible, UV, and/or infrared light. 
     
     
       3. The chip module according to  claim 1 , further comprising:
 a second recess structure arranged in the carrier in the first main surface opposite to the first metallization structure; and 
 a third recess structure arranged in the carrier in the first main surface opposite to the second metallization structure. 
 
     
     
       4. The chip module according to  claim 1 , wherein the vias extend through the first and the second metallization structures. 
     
     
       5. The chip module according to  claim 1 , wherein the first and second metallization structures are each patterned with a continuous metallization member extending over edge portions of the chip module on the second main surface and with a metallization land extending from the continuous metallization member towards a centre portion of the chip module. 
     
     
       6. The chip module according to  claim 1 , wherein the chip in the recess structure is molded with a mold material. 
     
     
       7. The chip module according to  claim 1 , wherein the chip is an RFID chip. 
     
     
       8. The chip module according to  claim 1 , further comprising:
 a first solder bump arranged on the first metallization structure; and 
 a second solder bump arranged on the second metallization structure. 
 
     
     
       9. The chip module according to  claim 3 , wherein the second and the third recess structures are vias which extend from the first main surface to the second main surface through the carrier. 
     
     
       10. An RFID label, comprising:
 a chip module according to  claim 7 ; and 
 a substrate having an RFID antenna structure, the chip module being soldered to the RFID antenna structure. 
 
     
     
       11. The RFID label according to  claim 10 , wherein the substrate is a textile substrate.