Selective soldering using fiber optic device

Abstract

A fiber optic device for enabling soldering is described. The fiber optic device includes an entry portion comprising an optical fiber bundle for receiving a single light beam wherein the optical fiber bundle splits the light beam into a plurality of separate portions, each of the separate portions for enabling soldering. The fiber optic device further includes an exit portion for emitting each of the plurality of separate portions of the light beam in a pattern to enable soldering at a plurality of locations simultaneously utilizing the single light beam.

What is claimed is: 
     
       1. A fiber optic device for enabling soldering comprising:
 a single entry point for receiving a single optical fiber bundle configured for receiving a single light beam wherein said optical fiber bundle splits said light beam into a plurality of separate portions, each of said separate portions for enabling soldering; and 
 an exit portion comprising a plurality of apertures, each for positioning a plurality of fibers of said optical fiber bundle and for emitting more than one of said plurality of separate portions of said light beam in a pattern to enable soldering at a plurality of locations simultaneously utilizing said single light beam, wherein a shape of each aperture of said plurality of apertures, a shape of said pattern of said plurality of fibers of said optical fiber bundle, and a shape of a corresponding solder pad match each other. 
 
     
     
       2. The fiber optic device of  claim 1  wherein said pattern substantially matches an array of solder pads associated with a flex cable. 
     
     
       3. The fiber optic device of  claim 1  wherein said plurality of apertures is arranged according to a geometry associated with solder locations on a flex cable. 
     
     
       4. The fiber optic device of  claim 1  wherein each of said plurality of apertures comprises an equal number of said fibers of said fiber optic bundle. 
     
     
       5. The fiber optic device of  claim 1  wherein said pattern enables localized soldering of a plurality of components such that said plurality of separate portions of said light beam is not applied directly to a substrate proximate to said plurality of components. 
     
     
       6. The fiber optic device of  claim 1  wherein said exit portion includes an optical lens for focusing each of said plurality of separate portions of said beams at a plurality of flex cable components. 
     
     
       7. A method for soldering comprising:
 providing a single entry point for receiving a single fiber optic bundle, said fiber optic bundle configured for receiving a single light beam for enabling soldering, said fiber optic bundle for splitting said single light beam into a plurality of separate beams, each of said separate beams for enabling soldering; and 
 providing an exit portion comprising a plurality of apertures, each for positioning more than one fiber of said fiber optic bundle, said exit portion for emitting each of said plurality of separate beams in a geometric pattern to enable soldering at a plurality of locations simultaneously with said single light beam, wherein a shape of each aperture of said plurality of apertures, a shape of said pattern of said fibers of said optical fiber bundle, and a shape of a corresponding solder pad match each other. 
 
     
     
       8. The method of  claim 7  further comprising:
 determining a geometric layout associated with a plurality of solder pads; and 
 providing said exit portion such that said pattern is associated with said geometric layout. 
 
     
     
       9. The method of  claim 7  further comprising:
 arranging said plurality of apertures according to a geometry associated with solder locations on a flex cable such that said plurality of beams is directed to said solder locations without damaging said flex cable. 
 
     
     
       10. The method of  claim 7  wherein each of said plurality of apertures is associated with an equal portion of said fiber optic bundle. 
     
     
       11. The method of  claim 7  further comprising:
 focusing each of said plurality of beams with an optical lens at one of said plurality of apertures. 
 
     
     
       12. A system for soldering comprising:
 a light source for generating a single light beam, said light beam for enabling soldering; and 
 a fiber optic beam shaper for shaping said single beam such that said single beam can be used to enable soldering of a plurality of components simultaneously, said fiber optic beam shaper comprising:
 a single entry point for receiving a single optical fiber bundle configured for receiving said single light beam and for splitting said light beam into a plurality of separate portions, each of said portions for enabling soldering; and 
 an exit portion comprising a plurality of apertures, each for positioning a plurality of fibers of said fiber optic bundle and for emitting more than one of said plurality of separate portions of said single light beam in a shaped pattern to enable soldering said plurality of components simultaneously with said single light beam, wherein a shape of each aperture of said plurality of apertures, a shape of said pattern of said plurality of fibers of said optical fiber bundle, and a shape of a corresponding solder pad match each other. 
 
 
     
     
       13. The system of  claim 12  wherein said shaped pattern substantially corresponds to a geometric layout of an array of solder pads. 
     
     
       14. The system of  claim 12  wherein said plurality of apertures is arranged according to a geometric layout of solder locations on a flex cable. 
     
     
       15. The system of  claim 12  wherein said shaped pattern enables localized soldering of said components on a flex cable such that said flex cable is not damaged. 
     
     
       16. The system of  claim 12  further comprising:
 an optical lens at one of said apertures for focusing each of said plurality of separate portions of said light beam at said plurality of components.