Integrated circuit manufacturing system

Abstract

An ICs modeling manufacturing procedure is disclosed. A first pattern is printed on a first surface of a printed circuit board (PCB). The first pattern includes a first barcode and a plurality of production codes. A plurality of elements are disposed on the first surface of the PCB. The PCB is heated to fix the elements on the first surface and secure the first pattern on the first surface of the PCB. When the first pattern is read, a first production information is obtained.

What is claimed is: 
     
       1. An integrated circuit (IC) modeling manufacturing system, comprising:
 a printed circuit board (PCB) comprising a first surface and a second surface opposite to the first surface; 
 a surface-mount technology (SMT) device printing a first pattern on the first surface of the PCB, disposing a plurality of elements on the first surface, and heating the PCB to fix the elements on the first surface and secure the first pattern on the first surface of the PCB, wherein the first pattern comprises a first barcode and a plurality of production codes and when the first pattern is read, a first production information is obtained; and 
 a processing device reading the first pattern to generate a second pattern, cutting the PCB into a plurality of small-sized PCBs, and collecting the cut small-sized PCBs. 
 
     
     
       2. The IC modeling manufacturing system as claimed in  claim 1 , wherein the second pattern comprises a second barcode and a plurality of processing codes, and the amount of production codes is less than the amount of processing codes. 
     
     
       3. The IC modeling manufacturing system as claimed in  claim 2 , further comprising:
 a writing device reading the second pattern to generate an encoded result and storing the encoded result into a storage unit, wherein a second production information is obtained according to the encoded result. 
 
     
     
       4. The IC modeling manufacturing system as claimed in  claim 3 , wherein the encoded result comprises a plurality of note codes, and the amount of processing codes is less than the note codes. 
     
     
       5. The IC modeling manufacturing system as claimed in  claim 3 , further comprising:
 a test device testing the PCB and the elements and storing the tested result to the storage unit. 
 
     
     
       6. The IC modeling manufacturing system as claimed in  claim 1 , wherein the first and the second production information is related to at least one of the elements and the PCB. 
     
     
       7. The IC modeling manufacturing system as claimed in  claim 6 , wherein the manufacturing date of the elements, the time of disposing the elements on the first surface or the manufacturing date of the PCB is obtained according to the first or the second production information. 
     
     
       8. The IC modeling manufacturing system as claimed in  claim 1 , wherein the SMT device reads the first pattern and prints the read result on the second surface of the PCB. 
     
     
       9. The IC modeling manufacturing system as claimed in  claim 8 , wherein the SMT device disposes a plurality of elements on the second surface of the PCB and the PCB is a dual in-line memory module (DIMM). 
     
     
       10. The IC modeling manufacturing system as claimed in  claim 1 , wherein the SMT device utilizes an ink-jet method to print the first pattern on the first surface of the PCB. 
     
     
       11. The IC modeling manufacturing system as claimed in  claim 1 , wherein the elements comprise volatile and non-volatile memories.