Isolation channel improving measurement accuracy of MEMS devices

Abstract

A system for improving the performance of a microelectromechanical systems (MEMS) device that is housed in a package and implemented on a printed circuit board (PCB) comprises a footprint, an isolation channel, and a bridge. A portion of the isolation channel is removed to mechanically isolate the MEMS device.

1. A system for improving the performance of a microelectromechanical systems (MEMS) device implemented on a printed circuit board, the system comprising:
 a footprint to receive the MEMS device within a first printed circuit board region; 
 at least one isolation channel passing through a portion of the printed circuit board to mechanically isolate the first printed circuit board region from a second non-overlapping printed circuit board region, the at least one isolation channel surrounding at least a portion of one of the first or second regions; and 
 at least one bridge located adjacent to the at least one isolation channel. 
 
     
     
       2. The system of  claim 1 , further including at least one electrical conductor to couple at least one component within the first printed circuit board region to at least one component within the second printed circuit board region. 
     
     
       3. The system of  claim 2 , wherein the at least one electrical conductor is an electrically conductive trace routed through the at least one bridge. 
     
     
       4. The system of  claim 1 , wherein the at least one bridge mechanically connects the first and the second regions of the printed circuit board. 
     
     
       5. The system of  claim 1 , wherein the at least one isolation channel surrounds at least 75% of the perimeter of one of the first or second regions. 
     
     
       6. The system of  claim 1 , wherein the at least one isolation channel surrounds at least a portion of every side of one of the first or second regions. 
     
     
       7. The system of  claim 1 , wherein the at least one isolation channel is elongated and is oriented generally parallel to the perimeter of one of the first or second regions. 
     
     
       8. The system of  claim 1 , further including the MEMS device, wherein the MEMS device is housed within a package that is operable to attach to the footprint. 
     
     
       9. The system of  claim 8 , wherein the MEMS device is one of an accelerometer or a pressure sensor. 
     
     
       10. The system of  claim 8 , wherein the package is a plastic package.