Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system

Abstract

A wedge lock for use with a single board computer includes a cooling plate positioned with respect to a printed circuit board (PCB), a clamp device configured to secure the single board computer in an operating environment, and a heat conductance plate positioned along a top surface of the cooling plate and a top surface of the clamp device to facilitate conduction cooling of the PCB.

1. A wedge lock for use with a single board computer, said wedge lock comprising:
 a cooling plate positioned with respect to a printed circuit board (PCB); 
 a clamp device configured to secure the single board computer in an operating environment; 
 a heat conductance plate positioned along a top surface of said cooling plate and a top surface of said clamp device to facilitate conduction cooling of the PCB; 
 wherein the heat conductance plate comprises a plurality of shims, and wherein at least a first portion of the shims are formed of a first material and at least a second portion of the shims are formed of a second material. 
 
     
     
       2. A wedge lock in accordance with  claim 1 , wherein said heat conductance plate comprises a material that provides a high thermal conductivity. 
     
     
       3. A wedge lock in accordance with  claim 1 , wherein said wedge lock provides a first thermal path that enables heat produced by the PCB to be removed, the first thermal path including said cooling plate and said clamp device. 
     
     
       4. A wedge lock in accordance with  claim 3 , wherein said wedge lock provides a second thermal path that enables heat produced by the PCB to be removed, the second thermal path including said cooling plate and said heat conductance plate. 
     
     
       5. A wedge lock in accordance with  claim 4 , wherein the second thermal path has a length that is shorter than a length of the first thermal path. 
     
     
       6. A wedge lock in accordance with  claim 1 , wherein said clamp device comprises a first sawtooth portion and a second sawtooth portion positioned with respect to said first sawtooth portion. 
     
     
       7. A wedge lock in accordance with  claim 6 , wherein said first sawtooth portion is configured to move in a first direction in order to induce a force on said second sawtooth portion in a second direction perpendicular to the first direction. 
     
     
       8. A wedge lock in accordance with  claim 7 , wherein the force induced on said second sawtooth portion in the second direction is induced on said heat conductance plate to secure the single board computer within the operating environment. 
     
     
       9. A single board computer comprising:
 a printed circuit board (PCB); and 
 a wedge lock configured to secure said single board computer within an operating environment, said wedge lock comprising:
 a cooling plate positioned with respect to said PCB; 
 a clamp device; and 
 a heat conductance plate positioned along a top surface of said cooling plate and a top surface of said clamp device to facilitate conduction cooling of said single board computer; 
 wherein the heat conductance plate comprises a plurality of shims, and wherein at least a first portion of the shims are formed of a first material and at least a second portion of the shims are formed of a second material. 
 
 
     
     
       10. A single board computer in accordance with  claim 9 , wherein said wedge lock provides a first thermal path that enables heat produced by said PCB to escape said single board computer via conduction, the first thermal path including said cooling plate and said clamp device. 
     
     
       11. A single board computer in accordance with  claim 10 , wherein said wedge lock provides a second thermal path that enables heat produced by said PCB to escape said single board computer via conduction, the second thermal path including said cooling plate and said heat conductance plate. 
     
     
       12. A single board computer in accordance with  claim 11 , wherein the second thermal path has a length that is shorter than a length of the first thermal path. 
     
     
       13. A single board computer in accordance with  claim 9 , wherein said clamp device comprises a first sawtooth portion and a second sawtooth portion positioned with respect to said first sawtooth portion. 
     
     
       14. A single board computer in accordance with  claim 13 , wherein said first sawtooth portion is configured to move in a first direction to induce a force on said second sawtooth portion in a second direction perpendicular to the first direction. 
     
     
       15. A single board computer in accordance with  claim 14 , wherein the force induced on said second sawtooth portion in the second direction is induced on said heat conductance plate to secure said single board computer within the operating environment. 
     
     
       16. A method of assembling a computer system that includes a single board computer, the single board computer including a printed circuit board (PCB), a cooling plate, a heat conductance plate positioned with respect to the cooling plate and a holding plate, and a clamp device, said method comprising:
 positioning the single board computer with respect to a thermal reference surface of the computer system; and 
 adjusting the clamp device in order to secure the single board computer within the computer system and to provide a plurality of thermal paths to facilitate conduction cooling of the single board computer; 
 wherein the heat conductance plate comprises a plurality of shims, and wherein at least a first portion of the shims are formed of a first material and at least a second portion of the shims are formed of a second material. 
 
     
     
       17. A method in accordance with  claim 16 , wherein adjusting the clamp device comprises rotating a screw in a first direction such that a first sawtooth portion of the clamp device imparts a force on a second sawtooth portion of the clamp device in a second direction perpendicular to the first direction. 
     
     
       18. A method in accordance with  claim 16 , wherein positioning the single board computer with respect to a thermal reference surface facilitates providing a first thermal path that includes the cooling plate and the clamp device. 
     
     
       19. A method in accordance with  claim 18 , wherein positioning the single board computer with respect to a thermal reference surface further facilitates providing a second thermal path that includes the cooling plate and the heat conductance plate, the second thermal path having a length that is shorter than a length of the first thermal path.