Process of forming an integrated multiplexed electrospray atomizer

Abstract

A process for forming an integrated multiplex electrospray includes forming multiple holes in a ring extractor substrate to create a ring extractor. A nozzle array having multiple nozzles each nozzle defining a central axis is provided. A spacer layer is bonded to either the ring extractor or the nozzle array to form a bonded stack. The bonded stack is then aligned with remaining layer to align each of the multiple nozzles with one of the plurality of holes to less than 10 microns from concentric and the spacer layer then bonded intermediate between the ring extractor and the nozzle array layer. The spacer layer is then etched to provide fluid communication between multiple nozzles and the multiple holes of the ring extractor and form the spacer.

1. An improved process for fabricating an integrated multiplexed electrospray atomizer containing a ring extractor, a nozzle array layer and a spacer intermediate between the ring extractor and the nozzle array layer, said process comprising:
 Forming a plurality of holes in a ring extractor substrate to create the ring extractor; 
 providing the nozzle array layer having a plurality of nozzles, each of said plurality of nozzles defining a central axis; 
 bonding a planar spacer layer to one of the ring extractor or the nozzle array layer to form a bonded stack of spacer-ring extractor or spacer-nozzle array layer, the improvement including that the spacer layer is an un-patterned substrate formed in-situ and does not require alignment; 
 aligning said un-patterned bonded stack of spacer layer-ring extractor with the nozzle array layer or said un-patterned bonded stack of spacer-nozzle array layer with the ring extractor; 
 bonding said un-patterned bonded stack of planar spacer-ring extractor to the nozzle array layer or said bonded stack of spacer-nozzle array layer to the ring extractor such that the un-patterned spacer layer is intermediate between the ring extractor and the nozzle array layer to form a bonded stack of nozzle array layer-spacer-ring extractor; and 
 said improvement being, etching said planar spacer layer within a bonded stack of nozzle array layer-spacer-ring extractor to provide fluid communication between the nozzle array layer and the ring extractor and to form the spacer. 
 
     
     
       2. The process of  claim 1  wherein said bonding of said un-patterned planar spacer layer to one of the ring extractor or the nozzle array layer is by anodic bonding. 
     
     
       3. The process of  claim 1  wherein said spacer layer is a material having a differential etch rate relative to the bonded ring extractor and the bonded nozzle array layer, said spacer layer being optically transparent.