Filter feedthrough for implants

Abstract

A new hermetically-sealed contact feedthrough for cardiac pacemakers and defibrillators for the connection between internal device electronics and external components, a flat ceramic disk ( 1 ) being used as an insulating main carrier, in which openings ( 3 ) are situated, into which various electrode embodiments ( 4, 5, 6, 7 ) may be inserted as through contacts. Using a metal flange or metal-plated vapor deposition zone ( 2 ), the ceramic disk may be soldered directly onto the implant housing ( 11 ). In addition, active and passive auxiliary components ( 8 ) may be applied directly to the ceramic. The main carrier may be implemented as a multilayer ceramic ( 9 ), so that rewiring levels and shielding components ( 10 ) may be integrated in the feedthrough. The feedthrough according to the present invention allows novel construction variants, above all things having orientation to multipolar systems, through use of standardized ceramic semifinished products.

1. A method for producing a contact feedthrough comprising:
 providing a flat ceramic; 
 structuring said flat ceramic to provide multiple flat ceramic disks which are capable of being used as a carrier ( 1 ) to be electrically connected to a housing ( 11 ) of an implantable device wherein said carrier ( 1 ) is configured so that said housing ( 11 ) of said implantable device does not enclose said carrier ( 1 ); 
 coating said multiple flat ceramic disks with metal to provide soldering areas; 
 providing a soldered connection on said soldering areas; and, 
 isolating said multiple flat ceramic disks from each other. 
 
     
     
       2. The method according to  claim 1 , wherein said structuring of said flat ceramic further comprises:
 producing at least one opening ( 3 ), which is capable of passing a contact ( 4 ,  5 ,  6 ,  7 ) through. 
 
     
     
       3. The method according to  claim 1  wherein said structuring of said flat ceramic is performed by punching, lasers, or notching. 
     
     
       4. The method according to  claim 1 , wherein said coating is performed with aid of masks or templates. 
     
     
       5. The method according to  claim 1 , wherein after said providing said soldered connection, coupling contacts ( 4 ,  5 ,  6 ,  7 ) with active and/or passive electrical components ( 8 ). 
     
     
       6. The method according to  claim 5 , further comprising providing shielding a housing interior from external electromagnetic radiation and/or for transmitting HF signals for telemetry over large distances using said active and/or passive electrical components ( 8 ). 
     
     
       7. The method according to  claim 1 , wherein said providing said flat ceramic comprises providing a multilayer ceramic capable of being used as said carrier ( 1 ). 
     
     
       8. The method according to  claim 7 , wherein said providing said multilayer ceramic ( 9 ) comprises providing said multilayer ceramic ( 9 ) comprising at least one internal layer, which is configured as a wiring level for connecting said active and/or passive electrical components ( 8 ). 
     
     
       9. The method according to  claim 8 , wherein said providing said multilayer ceramic ( 9 ) comprising at least one internal layer comprises providing a capacitor area in said at least one internal layer.