Heat dissipation assembly for computing devices

Abstract

An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to and proximate the socket for preventing water of condensation from contacting areas covered by the water barrier and a moisture absorbent surrounding the heat sink.

1. An assembly for use in a computing device comprising a microprocessor and a mother board that includes a socket for receiving and making electric contact with said microprocessor, said assembly further comprising a casing surrounding at least a portion of said microprocessor, said casing having an inlet and outlet for circulating a coolant proximate said microprocessor and wherein a water barrier is applied to and proximate said socket for preventing water condensation from contacting areas covered by said barrier. 
   
   
     2. The assembly of  claim 1  wherein said water barrier comprises a layer of dielectric grease. 
   
   
     3. The assembly of  claim 2  wherein said dielectric grease comprises a paste spread over said socket. 
   
   
     4. The assembly of  claim 1  wherein said water barrier comprises a low viscosity liquid sprayed over and in proximity to said socket. 
   
   
     5. The assembly of  claim 1  wherein said water barrier comprises a liquid in which said motherboard can be dipped. 
   
   
     6. The assembly of  claim 1  wherein said microprocessor comprises a CPU in the form of a die appended to a support, said support being in electrical contact with said socket. 
   
   
     7. The assembly of  claim 6  wherein said water barrier is further applied to said support surrounding and abutting said die.