Method of improving adhesion between two dielectric films

Abstract

A method of improving adhesion between layers in the formation of a semiconductor device and integrated circuit, and the resultant intermediate semiconductor structure, which include a substrate layer with a low k insulating layer thereover. The low k insulating layer includes a treated surface area of adsorbed gaseous particles. This treated surface area is formed by flowing a gas, preferably, silane, disilane, dichlorosilane, germane or combinations thereof, over a surface of the heated low k insulating layer for adsorption of such gaseous particles onto the heated surface, wherein the insulating layer maintains its original thickness. A capping layer is then deposited directly over the insulating layer wherein the treated surface area of the insulating layer significantly improves adhesion between the insulating layers and the capping layers to prevent delamination therebetween during subsequent processing steps of forming the integrated circuit.

1. An intermediate semiconductor structure comprising:
 a substrate layer; 
 an insulator layer disposed over said substrate layer; 
 a treated surface area of said insulator layer having adsorbed gaseous germane particles; and 
 a capping layer disposed over said treated surface area of said insulator layer, wherein said treated surface area prevents delamination between said insulator layer and said capping layer. 
 
   
   
     2. The intermediate semiconductor structure of  claim 1  further including a dielectric layer disposed between said substrate layer and said insulator layer. 
   
   
     3. The intermediate semiconductor structure of  claim 2  wherein said dielectric layer has a thickness ranging from about 300 Å to about 800 Å. 
   
   
     4. The intermediate semiconductor structure of  claim 1  wherein said insulating layer has a thickness ranging from about 2,000 Å to about 10,000 Å. 
   
   
     5. The intermediate semiconductor structure of  claim 1  wherein said insulating layer comprises a low k dielectric. 
   
   
     6. The intermediate semiconductor structure of  claim 5  wherein said capping layer is selected from the group consisting of silicon oxide, silicon carbide and silicon nitride. 
   
   
     7. The intermediate semiconductor structure of  claim 5  wherein said low k dielectric comprises a material selected from the group consisting of organo silicate glass, polyimide, organic siloxane polymer, polyarylene ether, methyl hydrogen, nano-porous silica, hydrogen silesquioxane glass and methyl silesquioxane glass. 
   
   
     8. The intermediate semiconductor structure of  claim 1  wherein said insulator layer with said treated surface area has an original thickness of said insulating layer. 
   
   
     9. The intermediate semiconductor structure of  claim 1  wherein said adsorbed gaseous particles are further selected from the group consisting of molecules, radicals, derivatives and combinations thereof.