Side connectors for RFID chip

Abstract

An RFID chip can have an RFID circuit having first and second initial bond pads and conductive paths on the RFID chip connecting the first and second bond pads to the different sides of the chip. The conductive paths including a first side connector on a first side of the chip electrically connected to the first bond pad and a second side connector on a second side of the chip connected to the second bond pad. The first and second side connectors can cover at least half of the first and second side length respectively.

1. A Radio Frequency Identification (RFID) chip comprising:
 a RFID circuit having first and second bond pads on a top surface of the RFID chip; and 
 conductive paths on the top surface of the RFID chip connecting the first and second bond pads along two opposite sides of the RFID chip respectively, the conductive paths including a first side connector on a first side of the two opposite sides on the top surface of the RFID chip electrically connected to the first bond pad and a second side connector on a second opposite sides on the top surface of the RFID chip connected to the second bond pad, wherein the first and the second side connectors protrude from the top surface of the RFID chip entirely covering two opposite side lengths of the respective opposite sides on the top surface the top of the RFID chip. 
 
     
     
       2. The RFID chip of  claim 1 , wherein the RFID chip includes an insulative layer over the RFID circuit. 
     
     
       3. The RFID chip of  claim 2 , wherein the conductive paths are on top of the insulative layer. 
     
     
       4. The RFID chip of  claim 2 , wherein the conductive paths and the connectors are formed in a metallization layer. 
     
     
       5. The RFID chip of  claim 4 , wherein chip is removed from a wafer after the metallization layer is formed. 
     
     
       6. A RFID unit comprising an RFID chip including:
 a RFID circuit having first and second bond pads on a top surface of the RFID chip; and 
 conductive paths on the top surface of the RFID chip connecting the first and second bond pads along two opposite sides of the RFID chip respectively, the conductive paths including a first side connector on a first side of the two opposite sides on the top surface of the RFID chip electrically connected to the first bond pad and a second side connector on a second side of the two opposite sides on the top surface of the RFID chip connected to the second bond pad; wherein the first and second side connectors protrude from the top surface of the RFID chip entirely covering two opposite side lengths of the respective opposite sides on the top surface of the RFID chip; and 
 a support unit electrically connected to the RFID chip such that the first and second side connectors contact the support unit. 
 
     
     
       7. The RFID unit of  claim 6 , wherein the RFID chip includes an insulative layer over the RFID circuit. 
     
     
       8. The RFID unit of  claim 7 , wherein the conductive paths are on top of the insulative layer. 
     
     
       9. The RFID unit of  claim 6 , wherein the conductive paths and the connectors are formed in a metallization layer. 
     
     
       10. The RFID unit of  claim 9 , wherein the chip is removed from a wafer after the metallization layer is formed.