Stud electrode and process for making same

Abstract

A process of making a stud capacitor structure is disclosed. The process includes embedding the stud in a dielectric stack. In one embodiment, the process includes forming an electrically conductive seed film in a contact corridor of the dielectric stack. A storage cell stud is also disclosed. The storage cell stud can be employed in a dynamic random-access memory device. An electrical system is also disclosed that includes the storage cell stud.

1. A stud capacitor structure comprising:
 a first conductive plug disposed above a substrate; 
 a stud coupled to the first conductive plug, the stud being partially embedded within a contact corridor in a first dielectric stack, wherein a width of the stud extending from the first dielectric stack is greater than a width of the contact corridor; and 
 an upper dielectric stack disposed above the first dielectric stack, wherein the stud extends into the upper dielectric stack. 
 
   
   
     2. The stud capacitor structure according to  claim 1 , the structure including a seed film disposed above the first conductive plug, wherein the seed film is below and on the stud. 
   
   
     3. The stud capacitor structure according to  claim 1 , the structure including:
 a storage cell dielectric film disposed over the stud; and 
 a storage cell plate disposed over the storage cell dielectric film. 
 
   
   
     4. The stud capacitor structure according to  claim 1 , the structure including a storage cell dielectric film disposed over the stud, wherein the storage cell dielectric film has a thickness in a range from about 30 Å to about 80 Å. 
   
   
     5. The stud capacitor structure according to  claim 1 , the structure including a storage cell dielectric film disposed over the stud, wherein the storage cell dielectric film is selected from titanium oxide, tantalum oxide, aluminum oxide, strontium titanate, barium strontium titanate, lead titanate, lead lanthanum titanate, lead lanthanum zirconium tantalate, lead zirconium titanate, strontium bismuth tantalate, and combinations thereof. 
   
   
     6. The stud capacitor structure according to  claim 1 , the structure including:
 a storage cell dielectric film disposed over the stud, wherein the storage cell dielectric film has a dielectric constant range from about 9 to about 300; and 
 a storage cell plate disposed over the storage cell dielectric film. 
 
   
   
     7. The stud capacitor structure according to  claim 1 , the structure including:
 a storage cell dielectric film disposed over the stud; and 
 a storage cell plate disposed over the storage cell dielectric film, wherein the storage cell plate is selected from the same material as the stud, platinum, rhodium, ruthenium, iridium, palladium, nickel, combinations thereof, and an alloy. 
 
   
   
     8. The stud capacitor structure according to  claim 1 , the structure including:
 a storage cell dielectric film disposed over the stud; and 
 a storage cell plate disposed over the storage cell dielectric film, wherein the storage cell plate is a different material from the stud, selected from a metal nitride, titanium nitride, tantalum nitride, and tungsten nitride. 
 
   
   
     9. The stud capacitor structure according to  claim 1 , the structure including a barrier structure disposed between and in contact with the stud above and the first conductive plug below. 
   
   
     10. The stud capacitor structure according to  claim 1 , the structure including a barrier structure disposed between and in contact with the stud above and the first conductive plug below, wherein the barrier structure is disposed above a polysilicon plug. 
   
   
     11. The stud capacitor structure according to  claim 1 , the structure including a barrier structure disposed between and in contact with the stud above and the first conductive plug below, wherein the barrier structure is disposed above a tungsten plug. 
   
   
     12. The stud capacitor structure according to  claim 1 , the structure including a barrier structure disposed between and in contact with the stud above and the first conductive plug below, wherein the barrier structure is disposed above and on the first conductive plug. 
   
   
     13. The structure of  claim 1 , wherein the stud extends in a vertical dimension that is significantly greater than the horizontal dimension. 
   
   
     14. The stud capacitor structure according to  claim 2 , wherein the seed film is embedded in the first dielectric stack. 
   
   
     15. An electronic system, comprising:
 a circuit module; 
 a user interface; and 
 a stud capacitor structure disposed in the circuit module or the user interface, the stud capacitor structure including:
 a first conductive plug disposed above a substrate; 
 a stud coupled to the first conductive plug, the stud being partially embedded within a contact corridor in a first dielectric stack, wherein a width of the stud extending from the first dielectric stack is greater than a width of the contact corridor; and 
 an upper dielectric stack disposed above the first dielectric stack, wherein the stud extends into the upper dielectric stack. 
 
 
   
   
     16. The electronic system according to  claim 15 , wherein the user interface includes at least one of a keyboard, a pointing device, a monitor, a printer, a tuning dial, a display and speakers of a radio, an automobile ignition switch, an automobile gas pedal, a card reader, a keypad, and an automated teller machine. 
   
   
     17. The electronic system according to  claim 15 , wherein the circuit module includes a single integrated circuit. 
   
   
     18. The electronic system of  claim 15 , wherein the stud capacitor structure includes a protective film remnant that is part of the first dielectric stack. 
   
   
     19. The electronic system of  claim 15 , wherein the stud capacitor structure includes a seed film disposed above the first conductive plug. 
   
   
     20. The electronic system of  claim 19 , wherein the seed film includes platinum. 
   
   
     21. The electronic system of  claim 19 , wherein the seed film includes a portion embedded in the first dielectric stack. 
   
   
     22. A memory system, comprising:
 a memory device; 
 a memory controller; 
 an external system bus; 
 a command link; and 
 a stud capacitor structure disposed in the circuit module or the user interface, the stud capacitor structure including:
 a first conductive plug disposed above a substrate; 
 a stud coupled to the first conductive plug, the stud being partially embedded within a contact corridor in a first dielectric stack, wherein a width of the stud extending from the first dielectric stack is greater than a width of the contact corridor; and 
 an upper dielectric stack disposed above the first dielectric stack, wherein the stud extends into the upper dielectric stack. 
 
 
   
   
     23. The memory system according to  claim 22 , wherein the memory system is selected from one of DIMM DRAM, a SIMM DRAM, a DIMM SDRAM, a SIMM SDRAM, a DTMM DDRAM, and a SIMM DDRAM.