De-soldering tool

Abstract

A de-soldering tool includes an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in an electrical connecter soldered to a printed wiring board; a lower heating device having a lower heating element for applying heat to a lower mating structure, the lower mating structure arranged in a pattern matching the solder connections on the underside of the PWB; a controller applying power to the upper heating element and the lower heating element to liquefy solder on the contacts in the electrical connecter.

1. A de-soldering tool for de-soldering an integrated circuit socket from a thermally dissipative printed wiring board comprising:
 an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in the integrated circuit socket soldered to the thermally dissipative printed wiring board, the upper mating structure including a plurality of pins arranged to contact individual contacts in the integrated circuit socket; 
 a lower heating device having a lower heating element for applying heat to a lower mating structure, the lower mating structure arranged in a pattern matching leads in the integrated circuit socket, the lower mating structure including a plurality of holes arranged to receive individual leads in the integrated circuit socket; 
 a controller applying power to the upper heating element and the lower heating element to liquefy solder on the leads in the electrical connecter. 
 
     
     
       2. The de-soldering tool of  claim 1  further comprising:
 grasping clips on the upper heating device, the grasping clips positioned to engage a periphery of the electrical connector. 
 
     
     
       3. The de-soldering tool of  claim 1  wherein:
 the grasping clips are hingedly attached to the upper heating device. 
 
     
     
       4. The de-soldering tool of  claim 1  wherein:
 the upper heating element includes a plurality of heating elements. 
 
     
     
       5. The de-soldering tool of  claim 1  wherein:
 the lower heating element includes a plurality of heating elements. 
 
     
     
       6. The de-soldering tool of  claim 1  further comprising:
 a thermal probe for monitoring temperature at one of the upper mating structure and the lower mating structure, the thermal probe providing a temperature signal to the controller. 
 
     
     
       7. A method of de-soldering an integrated circuit socket soldered to a thermally dissipative printed wiring board, the method comprising:
 obtaining an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in the integrated circuit socket soldered to the thermally dissipative printed wiring board, the upper mating structure including a plurality of pins arranged to contact individual contacts in the integrated circuit socket; 
 placing the upper mating structure in contact with electrical contacts in the connector; 
 obtaining a lower heating device having a lower heating element for applying heat to a lower mating structure, the lower mating structure arranged in a pattern matching soldered leads of the integrated circuit socket, the lower mating structure including a plurality of holes arranged to receive individual leads in the integrated circuit socket; 
 placing the lower mating structure in contact with solder around the leads; 
 energizing the upper heating element; and 
 energizing the lower heating element. 
 
     
     
       8. The method of  claim 7  further comprising:
 securing grasping clips about the periphery of the connector; and 
 lifting the connector from the printed wiring board after energizing the upper heating element and the lower heating element.