Method to control a management system to control semiconductor manufacturing equipment

Abstract

In the control method in a management system of semiconductor manufacturing equipment to enhance a product yield through a control of etching process, information of a corresponding lot for the etching process is recognized. It is checked whether the information of corresponding lot is for an etching process after a predetermined RF time of etching apparatus. RF time of the etching apparatus is compared with the predetermined RF time, and it is decided whether the etching process of corresponding lot can be performed in the etching apparatus if the etching process for the corresponding lot should be performed after a lapse of the predetermined RF time.

1. A method to control a management system, comprising:
 loading a batch of wafers in an etching apparatus; 
 determining whether the batch of wafers has a Radio Frequency (RF) time limit requirement; and 
 checking an RF time of the etching apparatus if the RF time of the batch of wafers has the RF time limit requirement, and executing an etching process on the batch of wafers if the RF time of the etching apparatus exceeds a predetermined RF time. 
 
   
   
     2. The method of  claim 1 , wherein if the RF time requirement for the batch of wafers is not limiting, executing an etching process on the batch of wafers. 
   
   
     3. The method of  claim 1 , wherein if the RF time of the etching apparatus has not reached a predetermined time, the host computer outputs an interlock signal, and transfers the batch of wafers to another etching equipment. 
   
   
     4. The method of  claim 3 , further comprising sounding an alarm or displaying a warning prior to outputting the interlock signal. 
   
   
     5. The method of  claim 1 , wherein if the RF time of the batch of wafers is not limiting, executing an etching process on the batch of wafers. 
   
   
     6. The method of  claim 1 , wherein a host computer checks for the RF time limit requirement for the batch of wafers. 
   
   
     7. The method of  claim 6 , wherein the RF time of the etching apparatus is stored in the host computer. 
   
   
     8. A method to control a management system, comprising:
 determining whether the batch of wafers has a Radio Frequency (RF) time limit requirement; 
 checking an RF time of a plurality of etching apparatuses if the RF time of the batch of wafers has the RF time limit requirement, 
 loading the batch of wafers into an etching apparatus, if one of the plurality of etching apparatuses has exceeded a predetermined RF time; and 
 executing an etching process on the batch of wafers. 
 
   
   
     9. The method of  claim 8 , wherein if none of the plurality etching apparatus has exceeded a predetermined RF time, delaying the etching process on the batch of wafers for a predetermined time until at least one of the plurality of etching apparatuses exceeds a predetermined RF time. 
   
   
     10. The method of  claim 8 , wherein if the RF time of the batch of wafers is not limiting, executing an etching process on the batch of wafers. 
   
   
     11. The method of  claim 8 , wherein a host computer checks for the RF time limit requirement for the batch of wafers. 
   
   
     12. The method of  claim 11 , wherein the RF time of the etching apparatus is stored in the host computer.