Backside failure analysis of integrated circuits

Abstract

Backside failure analysis of integrated circuits. In one embodiment, a method of preparing a device under test (DUT) for an image based diagnostic testing is disclosed. The method comprises removing a portion of the backside package of the DUT to allow for the implementation of an image based diagnostic test through the backside of the DUT. The functionality of DUT is destroyed by the removal of the portion of the backside package of the DUT. Further, restoring the functionality of the DUT with an interface carrier before an image based diagnostic test is conducted.

1. A method of preparing a device under test (DUT) for an image based diagnostic test, the method comprising:
 removing a portion of the backside package of the DUT to allow for the implementation of a image based diagnostic test through the backside of the DUT, the electrical functionality of DUT being destroyed by the removal of the portion of the backside package of the DUT; and 
 restoring the electrical functionality of the DUT with an interface carrier before an image based diagnostic test is conducted. 
 
     
     
       2. The method of  claim 1 , wherein the removing of the portion of the backside package of the DUT further comprises:
 mechanically polishing the backside of the package. 
 
     
     
       3. The method of  claim 1 , wherein the removing of the portion of the backside package of the DUT further comprises:
 decapsulating the backside package with a laser. 
 
     
     
       4. The method of  claim 1 , wherein the removing of the portion of the backside package of the DUT further comprises:
 etching the backside of the package. 
 
     
     
       5. The method of  claim 1 , wherein removing the portion of the backside of the package of the DUT further comprises:
 removing package resin. 
 
     
     
       6. The method of  claim 1 , wherein removing the portion of the backside of the package of the DUT further comprises:
 removing solder balls. 
 
     
     
       7. The method of  claim 1 , wherein removing the portion of the backside of the package of the DUT further comprises:
 removing select signal layers. 
 
     
     
       8. The method of  claim 1 , further comprising:
 verifying the functionality of the DUT. 
 
     
     
       9. The method of  claim 1 , wherein removing the portion of the backside of the package exposes device contacts of the DUT. 
     
     
       10. The method of  claim 9 , wherein restoring functionality of the DUT comprises:
 electrically coupling select exposed device contacts with select interface contact of the interface carrier. 
 
     
     
       11. The method of  claim 10 , wherein electrically coupling the select exposed device contacts with select interface contact of the interface carrier further comprises:
 bonding wires across the select device contacts and select interface contacts. 
 
     
     
       12. A method of testing a device under test (DUT), the method comprising:
 removing a portion of a backside of the DUT to expose a select signal layer the electrical functionality of the DUT being destroyed by the removal of the portion of the backside package of the DUT; 
 coupling the DUT to an interface carrier; 
 electrically coupling select device contacts of the exposed select signal layer of the DUT to select interface contacts of the interface carrier to restore electrical functionality of the DUT; and 
 testing the DUT after the functionality of the DUT has been restored. 
 
     
     
       13. The method of  claim 12 , wherein removing the portion of the backside of the DUT further comprises:
 mechanically polishing the backside of the DUT. 
 
     
     
       14. The method of  claim 12 , wherein removing the portion of the backside of the DUT further comprises:
 decapsulating the backside of the DUT with a laser. 
 
     
     
       15. The method of  claim 12 , wherein removing the portion of the backside of the DUT further comprises:
 etching the backside of the DUT. 
 
     
     
       16. The method of  claim 12 , wherein electrically coupling select device contacts of the exposed select signal layer of the DUT to select interface contacts of the interface carrier further comprises:
 bonding wires to each select device contact and its associated interface contact. 
 
     
     
       17. The method of  claim 12 , wherein the testing of the DUT further comprises:
 performing an image based diagnostic test through the backside of the DUT. 
 
     
     
       18. The method of  claim 12 , further comprising:
 verifying the functionality of the DUT after the DUT has been electrically coupled to the interface carrier.