Modular communication jack with low assembling tolerance
Abstract
A modular communication jack with low assembling tolerance includes a circuit board being provided on a front portion with spring contact terminals for contacting with a communication plug, and on a rear portion with Insulation Displace Contact terminals for contacting with wire cores of a communication cable; an insulated inner housing assembled to a top of the circuit board to prevent the circuit board from moving in X-direction and Y-direction, and being formed at a front portion with a cavity for receiving a communication plug; an insulated bottom member assembled to a bottom of the circuit board and fixedly connected to the inner housing to sandwich the circuit board between the inner housing and the bottom member and further prevent the circuit board from moving in Z-direction; and an outer housing enclosing an assembly of the inner housing, the bottom member, and the circuit board therein.
Claims
exact text as granted — not AI-modified1. A module communication jack with low assembling tolerance, comprising:
a circuit board being provided on a front portion with a plurality of spring contact terminals in a bent configuration, and on a rear portion with a plurality of insulation displace contact (IDC) terminals;
an insulated inner housing assembled to a top of said circuit board and having downward projected structures to prevent said circuit board from moving in a horizontal direction with respect to said insulated inner housing; said insulated inner housing is provided with a plurality of protrusions and a cavity to serve as an insertion hole for receiving a communication plug, a plurality of openings being formed in said cavity in order to locate the spring contact terminals;
an insulated bottom member assembled to a bottom of said circuit board and fixedly connected to said insulated inner housing through engagement of upward locating structures provided on a said insulated bottom member with downward flat guiding structures provided below said insulated inner housing, such that said circuit board is located between said insulated bottom member and said insulated inner housing so that said circuit board is prevented from moving in up and down direction with respect to said inner housing and said bottom member; and
an outer housing defining an inner receiving space to enclose and fix an assembly of said insulated inner housing, said insulated bottom member, and said circuit board therein.
2. The module communication jack with low assembling tolerance as claimed in claim 1 , wherein said spring contact terminals provided on the front portion of said circuit board are upward exposed and protruded from a bottom of said cavity at the front portion of said insulated inner housing.
3. The module communication jack with low assembling tolerance as claimed in claim 1 , wherein said circuit board is a soft circuit board.
4. The module communication jack with low assembling tolerance as claimed in claim 1 , wherein said circuit board is in the form of a sheet metal.Join the waitlist — get patent alerts
Track US7040933B1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.