Electrical contact pin carrying a charge of solder and process for producing it

Abstract

According to the invention, said charge of solder is in the form of a ring ( 9 ) crimped onto to said pin ( 1 ), coaxially with the latter.

1. A process for producing an electrical contact pin carrying a charge of solder, comprising:
 producing said charge of solder in the form of a piece having at least approximately the shape of a staple; 
 placing said piece around said pin by moving said piece transversely to said pin; and 
 crimping said piece around said pin in order to form a ring firmly fixed to said pin. 
 
   
   
     2. The process as claimed in  claim 1 , in which a surface irregularity is formed on said pin at the place where said piece of solder is attached and crimped. 
   
   
     3. The process as claimed in  claim 2 , in which said surface irregularity is in the form of a recess. 
   
   
     4. The process as claimed in  claim 2 , in which said surface irregularity is in the form of a raised feature. 
   
   
     5. The process as claimed in  claim 2 , in which said surface irregularity is obtained by stamping.