LGA to PGA package adapter

Abstract

An adapter assembly is provided for adapting an LGA packaged IC to a PGA socket. The adapter assembly comprises a package body with a plurality of through holes, and a plurality of pins received in the through holes and each having a spring end and an insertion end. The spring end of the pin abuts against an electric contact land of the LGA packaged IC and the insertion end of the pin is inserted into the PGA socket, whereby the LGA packaged IC is in electrical connection to the PGA socket.

1. An adapter for combining a land grid array (LGA) packaged integrated circuit (IC) with a pin grid array (PGA) socket, the adapter comprising:
 an adapter body having a plurality of through holes formed thereon and a plurality of uniformly distributed bumps on an upper face thereof for supporting the LGA packaged IC thereon; and 
 a plurality of pins respectively fit within the through holes of the adapter body, and the pins each having a cylindrical insertion column and a cantilevered elastic arm integrally extended from a top portion of the insertion column; 
 wherein the adapter body has at least one edge guiding section on a corner thereof; 
 wherein the adapter body has a locking section on a lateral face thereof to latch the LGA packaged IC onto the package body, where the locking section is only applied at the edges of said adapter body; and 
 wherein the cantilevered elastic arm of each pin elastically abuts against an electric contact land of the LGA packaged IC, and a bottom portion of the cylindrical insertion column of each pin connects to the PGA socket. 
 
     
     
       2. The adapter assembly as in  claim 1 , wherein the adapter body has at least one side guiding section on a lateral face thereof. 
     
     
       3. The adapter assembly as in  claim 1 , wherein the locking section is a concave slot. 
     
     
       4. The adapter assembly as in  claim 1 , wherein the locking section is a protruded knob. 
     
     
       5. The adapter assembly as in  claim 1 , wherein the adapter body is made of an insulating material. 
     
     
       6. The adapter assembly as in  claim 5 , wherein the adapter body is made of plastics. 
     
     
       7. The adapter assembly as in  claim 1 , wherein the pin is made of a conductive elastic material. 
     
     
       8. The adapter assembly as in  claim 7 , wherein the conductive material is beryllium copper alloy. 
     
     
       9. The adapter assembly as in  claim 1 , wherein said cantilevered elastic arm is a spring end. 
     
     
       10. The adapter assembly as in  claim 1 , wherein said bottom portion of the cylindrical insertion column is an insertion end for being received in a through hole. 
     
     
       11. An adapter for combining a land grid array (LGA) packaged integrated circuit (IC) with a pin grid array (PGA) socket, the adapter comprising:
 an adapter body having a plurality of through holes formed thereon and a plurality of uniformly distributed bumps on an upper face thereof for supporting the LGA packaged IC thereon; and 
 a plurality of pins respectively fit within the through holes of the adapter body, and the pins each having a cylindrical insertion column and a cantilevered elastic arm integrally extended from a top portion of the insertion column; 
 wherein the cantilevered elastic arm of each pin elastically abuts against an electric contact land of the LGA packaged IC, and 
 a bottom portion of the cylindrical insertion column of each pin connects to the PGA socket.