Method of fabricating and repairing ceramic components for semiconductor fabrication using plasma spray process

Abstract

Provided is a method of fabricating and repairing ceramic components for semiconductor fabrication, through which erosion and polymer deposition occurring on ceramic components for semiconductor fabrication are decreased by modifying the dielectric surface of a component having an electrical insulation characteristic so that the ceramic components can be repaired after being used. The method includes activating a surface layer of a component, which is manufactured by sintering a ceramic, and depositing a dielectric coating layer on the surface layer of the ceramic component using a plasma spray process; when the dielectric coating layer is damaged as the ceramic component is used for semiconductor fabrication, removing the dielectric coating layer; and repairing the ceramic component by depositing a dielectric coating layer on the surface layer of the ceramic component from which the damaged dielectric coating layer has been removed.

What is claimed is:  
     
       1. A method of manufacturing and repairing a ceramic component for semiconductor fabrication, the method comprising: 
       activating a surface layer of a ceramic component, which is manufactured by sintering a ceramic, and depositing a dielectric coating layer on the surface layer of the ceramic component using a plasma spray process, wherein the step of depositing the dielectric coating layer on the surface layer of the ceramic component comprises depositing one material selected from the group consisting of alumina, zirconia, yttria, and YAG on the surface layer of the ceramic component;  
       when the dielectric coating layer is damaged as the ceramic component is used for semiconductor fabrication, removing the dielectric coating layer; and  
       repairing the ceramic component by depositing a dielectric coating layer on the surface layer of the ceramic component from which the damaged dielectric coating layer has been removed.  
     
     
       2. The method of  claim 1 , wherein the repairing the ceramic component comprises depositing one material selected from the group consisting of alumina, zirconia, yttria, and YAG on the surface layer of the ceramic component.