Interconnect device for electrically coupling a test system to a circuit board adapted for use with a ball-grid array connector

Abstract

A presently-preferred interconnect device for electrically coupling a test instrument and a circuit board having a first portion of a ball grid array connector mounted thereon comprises a pin header and a second portion of the ball grid array. The second portion is mounted on the pin support member and comprises a plurality of electrically conductive contact members each being electrically coupled to a respective terminal pin of the pin header. The interconnect device further comprises a circuit substrate having a plurality of electrical connection points formed on a surface thereof and being adapted to be electrically coupled to the test instrument, and a socket receptacle mounted on the circuit substrate. The socket receptacle comprises a plurality of pin receptacles adapted to removably receive a respective one of the terminal pins and being electrically coupled to a respective electrical connection point.

What is claimed is:  
     
       1. A method of maintaining an interconnect device for electrically coupling a test instrument to a circuit board having a first portion of a ball grid array connector mounted thereon, the method comprising: 
       separating one of a pin header and a socket receptacle of the interconnect device having a second portion of the ball grid array connector mounted thereon from the other of the pin header and the socket receptacle after the second portion of the ball-grid array connector has undergone a predetermined number of mating cycles with a plurality of the first portions of the ball-grid array connector; and  
       subsequently mating another of the one of a pin header and a socket receptacle of the interconnect device having a second portion of the ball grid array connector mounted thereon with the other of the pin header and the socket receptacle.  
     
     
       2. A method of maintaining an interconnect device for electrically coupling a test instrument to a circuit board having a first portion of a ball grid array connector mounted thereon, the method comprising: 
       separating one of a pin header and a socket receptacle of the interconnect device having a second portion of the ball grid array connector mounted thereon from the other of the pin header and the socket receptacle in response to a predetermined wear criterion for the second portion of the ball-grid array connector; and  
       subsequently mating another of the one of a pin header and a socket receptacle of the interconnect device having a second portion of the ball grid array connector mounted thereon with the other of the pin header and the socket receptacle.