US6759348B1ExpiredUtilityA1
Pattern and its forming method of liquid crystal display device
Est. expiryDec 31, 2022(expired)· nominal 20-yr term from priority
H10D 86/60H10D 86/40H10D 86/0231G03F 7/0002B82Y 40/00G03F 7/161B82Y 10/00G02F 1/13H10K 71/13
80
PatentIndex Score
25
Cited by
15
References
11
Claims
Abstract
A method for forming a pattern includes filling a resist in a groove of a cliché corresponding to the position of the pattern to be formed, transferring the resist which is filled in the groove onto a printing roll by rotating the printing roll in a direction parallel to the longest portion lengthwise direction of a pattern formed in cliché, and applying the resist on an etching object layer by rotating the printing roll along the etching object layer on a substrate.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method for forming a pattern, comprising:
filling a resist in a groove of a cliché corresponding to the position of the pattern to be formed;
transferring the resist which is filled in the groove onto a printing roll by rotating the printing roll in a direction parallel to the longest portion lengthwise direction of a pattern formed in cliché; and
applying the resist on an etching object layer by rotating the printing roll along the etching object layer on a substrate.
2. The method of claim 1 , wherein the step of filling the resist in the groove of the cliché includes:
applying the resist on the cliché;
filling the resist in the groove by pulling a doctor blade in a pulling direction across the surface of the cliché to flatten the resists into the grooves; and
removing excess resist that remains on the surface of the cliché except for in the groove.
3. The method of claim 2 , wherein the pulling direction is parallel to the longest portion lengthwise direction of the pattern formed in cliché that is parallel to a longest length groove in the cliché.
4. The method of claim 1 , wherein the etching object layer includes a metal layer.
5. The method of claim 1 , wherein the etching object layer includes an insulating layer which is composed of SiO x or SiN x .
6. The method of claim 1 , wherein the etching object layer includes a semiconductor layer.
7. The method of claim 1 , further comprising:
providing a cliché for a pattern having a first pattern feature along the longest portion lengthwise direction and a second pattern feature protruding from the first pattern feature, wherein the second pattern feature has a side at an angle smaller than 90° from the longest portion lengthwise direction of the first pattern feature.
8. The method of claim 1 , further comprising:
providing a cliché for a pattern having a first pattern feature along the longest portion lengthwise direction, a second pattern feature in parallel with the first pattern feature, and third pattern feature interconnecting the first and second pattern features.
9. A method for forming a pattern, comprising:
providing a cliché in which a groove is formed in a region corresponding to a shape of a pattern to be formed;
filling a resist into the groove and removing the resist which remains on the surface of the cliché except for resist within the groove by pulling a doctor blade in a pulling direction parallel a longest portion lengthwise direction of the groove to flatten the resist;
transferring the resist onto a printing roll by rotating the printing roll on the cliché along the longest portion lengthwise direction of the groove; and
applying the resist on the etching object layer by rotating the printing roll along the an etching object layer on a substrate.
10. The method of claim 9 , further comprising:
providing a cliché for a pattern having a first pattern feature along the longest portion lengthwise direction and a second pattern feature protruding from the first pattern feature, wherein the second pattern feature has a side at an angle smaller than 90° from the longest portion lengthwise direction of the first pattern feature.
11. The method of claim 9 , further comprising:
providing a cliché for a pattern having a first pattern feature along the longest portion lengthwise direction, a second pattern feature in parallel with the first pattern feature, and third pattern feature interconnecting the first and second pattern features.Join the waitlist — get patent alerts
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