System for and method of using developer as a solvent to spread photoresist faster and reduce photoresist consumption

Abstract

An exemplary method of using developer as a solvent to spread photoresist faster and reduce photoresist consumption can include dispensing a developer solution onto an integrated circuit wafer, spinning the integrated circuit wafer to distribute the developer solution over the integrated circuit wafer, and dispensing a photoresist solution onto the integrated circuit covered with the developer solution.

What is claimed is:  
     
       1. A method of using developer as a solvent to spread photoresist faster and reduce photoresist consumption, the method comprising: 
       dispensing a developer solution onto an integrated circuit wafer;  
       spinning the integrated circuit wafer to distribute the developer solution over the integrated circuit wafer; and  
       dispensing a photoresist solution onto the integrated circuit wafer covered with the developer solution.  
     
     
       2. The method of  claim 1 , further comprising spinning the integrated circuit wafer to distribute the photoresist solution over the integrated circuit wafer. 
     
     
       3. The method of  claim 1 , wherein the developer solution is coated over the integrated circuit wafer at a thickness of between 1 μm and 5 μm. 
     
     
       4. The method of  claim 1 , wherein the step of dispensing a photoresist solution comprises dispensing 2 cubic cm of photoresist solution to cover the integrated circuit wafer. 
     
     
       5. The method of  claim 1 , wherein the step of dispensing a developer solution comprises spraying developer solution from a nozzle. 
     
     
       6. The method of  claim 5 , wherein the step of dispensing a photoresist solution comprises spraying photoresist solution from a different nozzle than the nozzle used to spray developer solution. 
     
     
       7. The method of  claim 5 , wherein the step of dispensing a photoresist solution comprises spraying photoresist solution from the same nozzle as the nozzle used to spray developer solution. 
     
     
       8. A method for efficient dispensing of photoresist material onto an integrated circuit substrate, the method comprising: 
       providing a developer coating onto an integrated circuit substrate;  
       dispensing a photoresist solution onto the integrated circuit substrate having the developer coating; and  
       rotating the integrated circuit substrate to distribute the photoresist solution over the integrated circuit substrate.  
     
     
       9. The method of  claim 8 , wherein the step of providing a developer coating comprises spraying a developer solution from a nozzle to the integrated circuit substrate. 
     
     
       10. The method of  claim 8 , wherein the step of providing a developer coating comprises pouring a developer solution from a pipe onto the integrated circuit substrate and spinning the integrated circuit substrate to distribute the developer solution over the integrated circuit substrate. 
     
     
       11. The method of  claim 8 , wherein the developer coating has a thickness of between 1 μm and 5 μm. 
     
     
       12. The method of  claim 8 , wherein the amount of photoresist solution dispensed is 2 cubic centimeters (cc) per substrate. 
     
     
       13. The method of  claim 8 , wherein the step of rotating the integrated circuit substrate is performed while developer solution is provided and while the photoresist solution is dispensed. 
     
     
       14. The method of  claim 8 , wherein developer solution for the developer coating and the photoresist solution come from two different nozzles.