US6356571B1ExpiredUtility

Semiconductor laser device and method of manufacture

Assignee: MOTOROLA INCPriority: Mar 4, 1998Filed: Aug 17, 2000Granted: Mar 12, 2002
Est. expiryMar 4, 2018(expired)· nominal 20-yr term from priority
H01S 5/18308H01S 5/18341H01S 5/18369
74
PatentIndex Score
10
Cited by
9
References
6
Claims

Abstract

A Vertical Cavity Surface Emitting Laser (VCSEL) ( 10 ) and a method for manufacturing the VCSEL ( 10 ). The VCSEL ( 10 ) includes a ridge structure ( 34 ), a first confinement layer ( 36 ) disposed adjacent to a portion of the ridge structure ( 34 ), and a second confinement layer ( 37 ) disposed on the first confinement layer ( 36 ) and disposed adjacent to a portion of the ridge structure ( 32 ). Carriers injected into the ridge structure ( 34 ) are confined by the first confinement layer ( 36 ).

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
       1. A semiconductor laser device, comprising: 
       a substrate having a surface;  
       a first distributed Bragg reflector disposed on the surface of the substrate;  
       a first cladding region disposed on the first distributed Bragg reflector;  
       an active region disposed on the first cladding region;  
       a second cladding region disposed on the active region;  
       a second distributed Bragg reflector disposed on a portion of the second cladding region;  
       a first confinement layer adjacent a portion of the second cladding region; and  
       a second confinement layer disposed on a portion of the first confinement layer.  
     
     
       2. The semiconductor laser device of  claim 1 , wherein the second cladding region includes: 
       an undoped layer disposed on the active region; and  
       a doped layer of a first conductivity type over the undoped layer.  
     
     
       3. The semiconductor laser device of  claim 2 , wherein the first confinement layer contacts a portion of the doped layer. 
     
     
       4. The semiconductor laser device of  claim 2 , wherein the second confinement layer contacts a portion of the doped layer. 
     
     
       5. The semiconductor laser device of  claim 2 , wherein the second confinement layer is spaced apart from the doped layer. 
     
     
       6. The semiconductor laser device of  claim 1 , further including a ridge structure formed from a portion of the second cladding region, wherein the first confinement layer is adjacent to the ridge structure.

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