US6317327B1ExpiredUtility

Diode cooling arrangement

56
Priority: Jan 4, 2001Filed: Jan 4, 2001Granted: Nov 13, 2001
Est. expiryJan 4, 2021(expired)· nominal 20-yr term from priority
Inventors:Chin-Feng Lin
H10W 72/07636H10W 72/07336H10W 72/652H10W 70/481H10W 70/442H10W 72/655H10W 72/60
56
PatentIndex Score
8
Cited by
6
References
1
Claims

Abstract

A diode cooling arrangement includes a crystal having two end faces and two metal radiating fins respectively soldered to the end faces of the crystal, one radiating fin having two upright flanges at two opposite lateral sides adapted to hold the crystal in the centered position during the soldering procedure.

Claims

exact text as granted — not AI-modified
What the invention claimed is:  
     
       1. A diode cooling arrangement comprising a crystal, said crystal having two opposite end faces respectively covered with a layer of soldering paste, and a first metal radiating fin and a second metal radiating fins respectively soldered to the end faces of said crystal, said metal radiating fins each having a leg for connection to a respective contact at a substrate, wherein said second radiating fin comprises two upright flanges disposed at two opposite lateral sides in contact with the periphery of said crystal.

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