US6275962B1ExpiredUtility

Remote test module for automatic test equipment

Assignee: TERADYNE INCPriority: Oct 23, 1998Filed: Oct 23, 1998Granted: Aug 14, 2001
Est. expiryOct 23, 2018(expired)· nominal 20-yr term from priority
G01R 31/3191G01R 31/31724G01R 31/31905
90
PatentIndex Score
171
Cited by
18
References
25
Claims

Abstract

A remote test module is disclosed for selectively interfacing a plurality of test channels between a tester interface and a plurality of specialized pins connected to a device-under-test. The tester interface is coupled to a test controller for generating predetermined test signals. The remote test module includes a signal conditioner responsive to the test controller for modifying said predetermined test signals into module test signals and applying the module test signals to the specialized pins of the device-under-test and a connection apparatus. The connection apparatus has a plurality of conductive paths for coupling the signal conditioner between the tester interface and the specialized pins.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
       1. A remote test module for selectively interfacing a plurality of test channels between a test head and a plurality of specialized pins connected to a device-under-test, said test head having a tester interface coupled to a test controller for generating predetermined test signals, said remote test module including: 
       a signal conditioner responsive to said test controller for modifying said predetermined test signals into module test signals and applying said module test signals to said specialized pins of said device-under-test; and  
       a connection apparatus having a plurality of conductive paths for coupling said signal conditioner between said tester interface and said specialized pins.  
     
     
       2. A remote test module according to claim  1  wherein: 
       said module test signals have predetermined minimum pulse widths; and  
       said conductive paths have respective path lengths that establish round trip delay times between said signal conditioner and said device-under-test less than said predetermined minimum pulse widths.  
     
     
       3. A remote test module according to claim  2  wherein: 
       said conductive paths between said device-under-test and said module measure less than approximately 2 inches.  
     
     
       4. A remote test module according to claim  1  wherein: 
       said specialized pins comprise high speed inputs and outputs.  
     
     
       5. A remote test module according to claim  4  wherein: 
       said specialized pins comprise a Rambus interface.  
     
     
       6. A remote test module according to claim  1  wherein: 
       said signal conditioner includes a multi-channel accelerator for increasing the frequency of the signals applied to said specialized pins.  
     
     
       7. A remote test module according to claim  6  wherein: 
       said accelerator comprises a plurality of multiplexers having respective inputs of a first frequency and respective outputs interleaved to generate frequencies higher than said first frequency.  
     
     
       8. A remote test module according to claim  1  and further including: 
       calibration circuitry responsive to calibration commands from said test controller.  
     
     
       9. A remote test module according to claim  8  wherein said calibration circuitry includes: 
       a plurality of phase shifters to calibrate edge timing to and from said device-under-test.  
     
     
       10. A remote test module according to claim  9  wherein said calibration circuitry further includes: 
       a memory responsive to calibration signals from said test controller; and  
       said phase shifters are coupled to said memory and responsive to said calibration signals.  
     
     
       11. A remote test module according to claim  9  wherein: 
       said phase shifters are coupled to a clock source to receive a conditioned signal and operative to delay said conditioned clock signal.  
     
     
       12. An automatic test apparatus for coupling to a device-interface-board and applying and receiving test signals to and from a device-under-test, said device-under-test mounted to said device interface board and including specialized test pins, said automatic test apparatus including: 
       a test controller which generates a plurality of master test signals;  
       a test head including a tester interface connected to said test controller for routing a majority of said master test signals to said device-interface-board; and  
       a remote test module for interfacing said tester interface to said specialized test pins, said remote test module including  
       a signal conditioner responsive to said test controller for applying said plurality of module test signals to said device-interface-board and  
       a connection apparatus having a plurality of conductive paths for coupling said specialized test pins to said signal conditioner and connecting to said device-interface-board.  
     
     
       13. An automatic test apparatus according to claim  12  wherein: 
       said module test signals have predetermined minimum pulse widths; and  
       said conductive paths have respective path lengths that establish round trip delay times between said signal conditioner and said device-interface-board less than said predetermined pulse widths.  
     
     
       14. An automatic test apparatus according to claim  13  wherein: 
       said conductive paths between said device-under-test and said module measure less than approximately 2 inches.  
     
     
       15. An automatic test apparatus according to claim  12  wherein: 
       said specialized test pins comprise high speed pins.  
     
     
       16. An automatic test apparatus according to claim  15  wherein: 
       said specialized test pins comprise a Rambus interface.  
     
     
       17. An automatic test apparatus according to claim  12  wherein: 
       said signal conditioner includes a multi-channel accelerator for increasing the frequency of the signals applied to said specialized pins.  
     
     
       18. An automatic test apparatus according to claim  17  wherein: 
       said accelerator comprises a plurality of multiplexers having respective inputs of a first frequency and respective outputs interleaved to generate frequencies higher than said first frequency.  
     
     
       19. An automatic test apparatus according to claim  12  and further including: 
       calibration circuitry responsive to calibration commands from said test controller.  
     
     
       20. An automatic test apparatus according to claim  19  wherein said calibration circuitry includes: 
       a plurality of phase shifters to calibrate edge timing to and from said device-under-test.  
     
     
       21. An automatic test apparatus according to claim  19  wherein said calibration circuitry further includes: 
       a memory responsive to calibration signals from said test controller; and  
       said phase shifters are coupled to said memory and responsive to said calibration signals.  
     
     
       22. An automatic test apparatus according to claim  19  wherein: 
       said phase shifters are coupled to a clock source to receive a conditioned signal and operative to delay said conditioned clock signal.  
     
     
       23. A method of adapting a semiconductor tester test head having a tester interface to a device-under-test, said device-under-test including specialized pins for receiving specialized test signals, said method including the steps of: 
       selecting a remote test module having a signal conditioner for receiving test signals from said test controller and modifying said signals into said specialized signals; and  
       interposing said remote test module between said tester interface and said device-under-test to apply said specialized signals to said specialized pins.  
     
     
       24. A method of minimizing timing errors on high frequency signals controlled by a test controller, said high frequency signals comprising pulses of a predetermined minimum pulse width and applied to a plurality of specialized pins on a device-under-test, said method including the steps of: 
       selecting a remote test module having a signal conditioner for multiplying the frequency of said high frequency signals generated by said test controller, said signal conditioner having a plurality of channel outputs;  
       positioning said remote test module proximate said device-under-test; and  
       interfacing said specialized device-under-test pins with said remote test module channel outputs to establish round-trip-delay times less than said predetermined minimum pulse widths.  
     
     
       25. A remote test module for selectively interfacing a plurality of test channels between a tester interface and a plurality of specialized pins connected to a device-under-test, said tester interface coupled to a test controller for generating predetermined test signals, said remote test module including: 
       a signal conditioner responsive to said test controller for modifying said predetermined test signals into module test signals having predetermined minimum pulse widths and applying said module test signals to said specialized pins of said device-under-test; and  
       a connection apparatus having a plurality of conductive paths for coupling said signal conditioner between said tester interface and said specialized pins, said conductive paths have respective path lengths that establish round trip delay times between said signal conditioner and said device-under-test less than said predetermined minimum pulse widths.

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