Self-locking conductive pin for printed wiring substrate electronics case

Abstract

An electronics case, a method of manufacturing the same and a power module incorporating the case. In one embodiment, the case includes: (1) an enclosure including a metal substrate and a dielectric material located on inner surfaces of the enclosure that insulate the substrate from electronics components located within the enclosure, the enclosure having an aperture on a major surface thereof and (2) an electrically conductive pin, passing through the aperture and an interior of the enclosure to emerge from the enclosure at a point opposite the major surface, the pin functioning both as a heat sink mount for the case and a case ground pin for the substrate.

What is claimed is: 
     
       1. An electronics case, comprising: an enclosure made of a metal substrate and a dielectric material located on inner surfaces of said enclosure that insulates said substrate from electronics components located within said enclosure, said enclosure having an aperture on a major surface thereof; and   an electrically conductive pin, passing through said aperture and into the interior of said and enclosure and emerging from said enclosure at a point opposite said major surface, said pin functioning both as a heat sink mount for said case and a case ground pin for said substrate.   
     
     
       2. The case as recited in claim 1 wherein said pin has a collar that locks said pin to a printed circuit board having electrically conductive traces located thereon. 
     
     
       3. The case as recited in claim 1 further comprising a plurality of electrically conductive traces located on said dielectric material and insulated from said substrate. 
     
     
       4. The case as recited in claim 1 wherein solder covers one end of said pin. 
     
     
       5. The case as recited in claim 1 wherein said components are components of a power converter. 
     
     
       6. The case as recited in claim 1 wherein said case is coupled to a printed circuit board having electrically conductive traces located thereon. 
     
     
       7. A power module, comprising: an enclosure made of a metal substrate and a dielectric material located on inner surfaces of said enclosure, said enclosure having an aperture on a major surface thereof;   an electrically conductive pin, passing through said aperture and into the interior of said enclosure and emerging from said enclosure at a point opposite said major surface, said pin functioning both as a heat sink mount for said module and a module ground pin for said substrate; and   power converter components coupled to said dielectric material, said material insulating said substrate from said power converter components.   
     
     
       8. The power module as recited in claim 7 further comprising a plurality of electrically conductive traces located on said dielectric material and insulated from said substrate. 
     
     
       9. The power module as recited in claim 8 wherein said pin has a collar that locks to a printed circuit board having electrically conductive traces located thereon. 
     
     
       10. The power module as recited in claim 9 wherein solder covers one end of said pin. 
     
     
       11. The power module as recited in claim 9 further comprising an encapsulant at least partially occupying said enclosure. 
     
     
       12. The power module as recited in claim 9 wherein said power module is coupled to a printed circuit board having electrically conductive traces located thereon.