US6143059AExpiredUtility
Self-catalytic bath and method for the deposition of a nickel-phosphorus alloy on a substrate
Est. expiryOct 21, 2016(expired)· nominal 20-yr term from priority
Inventors:Abdallah TangiMohamed ElharkAli Ben BachirAbdallah ShririMohamed CherkaouiMohamed EbntouhamiMustapha Saaoudi El
C23C 18/36H05K 3/244
55
PatentIndex Score
20
Cited by
6
References
16
Claims
Abstract
Disclosed are a self-catalytic bath and a method for the deposition of Ni-P alloy on a substrate. The bath comprises nickel sulfate, sodium hypophosphite as a reducing agent, acetic acid as a buffer and traces of lead as a stabilizer. It also includes a citrate used as a complexing agent associated with a gluconate used both as a catalyst and a stabilizer. The disclosed bath makes it possible to tolerate large quantities of hypophosphite and is relatively long-lived. Furthermore, it can be used to prepare large quantities of Ni-P alloy per liter of solution.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A self-catalytic bath comprising: nickel sulfate; sodium hypophosphite as a reducing agent; acetic acid as a buffer; traces of lead as a stabilizer; and a citrate used as a complexing agent and is associated with a gluconate that is used both as a catalyst and a stabilizer.
2. The bath according to claim 1, wherein the citrate is sodium tricitrate and the gluconate is sodium gluconate.
3. The bath according to claim 2, wherein, for a quantity of sodium tricitrate equal to 79 g/l, the bath includes about 229 g/l of sodium hypophosphite.
4. The bath according to claim 2, comprising; about 0.1 M NiSO 4 : 6H 2 O; about 0.15 M Na 3 C 6 H 5 O 7 :2H 2 O; about 0.33 M NaH 2 PO 2 :H 2 O; about 0.092 M C 6 H 11 NaO 7 ; about 0.024 M CH 3 CO 2 H; traces of lead; and wherein the pH is set at about 5.5 and the temperature is set at about 85 to about 89° C.
5. The bath according to claim 3, comprising; about 0.1 M NiSO 4 : 6H 2 O; about 0.15 M Na 3 C 6 H 5 O 7 :2H 2 O; about 0.024 M CH 3 CO 2 H; about 0.33 M NaH 2 PO 2 :H 2 O; about 0.092 M C 6 H 11 NaO 7 ; traces of lead; and wherein the pH is set at about 5.5 and the temperature is set at about 85 to about 89° C.
6. The bath according to claim 1, further comprising a deposition rate of at least about 12 μm/h.
7. The bath according to claim 6 providing deposited coatings having shiny appearance.
8. A bath according to claim 1 including a concentration of sodium hypophosphite to a concentration of Ni 2+ ions from nickel sulfate having a ratio of up to 3 to 4.
9. A self-catalytic bath comprising: nickel sulfate; sodium hypophosphite as a reducing agent; acetic acid as a buffer; traces of lead as a stabilizer; sodium gluconate as a catalyst and a stabilizer; and complexing agent selected to reduce a concentration of free metal ions in the bath by several magnitudes and thus reduce electric potential in order to control kinetics of deposition of a nickel-phosphorous alloy.
10. A bath according to claim 9 wherein said complexing agent is sodium tricitrate.
11. A bath according to claim 10 wherein said sodium gluconate bas a concentration of up to 20 g/l.
12. A bath according to claim 10 wherein the pH is set at about 5.5 and the temperature is set at about 85° C. to about 89° C.
13. A self-catalytic bat comprising: nickel sulfate; sodium hypophosphite as a reducing agent; acetic acid as a buffer; traces of lead as a stabilizer; a citrate used as a complexing agent; and a catalyst and a stabilizer, said catalyst including hydroxide functions capable of picking up H + protons, thus preventing adsorption of the H + protons on the surface of a substrate during deposition of a nickel-phosphorous alloy, said stabilizer preventing decomposition of the bath and increasing deposition of said nickel-phosphorous alloy.
14. A bath according to claim 13 wherein said catalyst and said stabilizer is sodium gluconate.
15. A bath according to claim 14 wherein said sodium gluconate has a concentration of up to 20 g/l.
16. A bath according to claim 14 wherein the pH is set at about 5.5 and the temperature is set at about 85° C to about 89° C.Join the waitlist — get patent alerts
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