Method for manufacturing a thin film actuated mirror having a flat light reflecting surface
Abstract
An inventive method for the manufacture of an array of thin film actuated mirrors includes the steps of: providing an active matrix; forming a plurality of insulating layers having a planarized top surface on top of the active matrix; forming a thin film sacrificial layer having an array of empty cavities on the planarized top surface of the plurality of insulating layers; forming an array of actuating structures on top of the thin film sacrificial layer including the empty cavities, each of the actuating structures including a first thin film electrode, a thin film electrodisplacive member, a second thin film electrode, an elastic member and a conduit; and removing the thin film sacrificial layer, thereby forming the array of thin film actuated mirrors. Since the thin film layers constituting each of the actuating structures are formed on the planarized top surface of the insulating layers, the thin film layers constituting each of the actuating structures are flat, allowing the first thin film electrode placed on top thereof, which also acts as a mirror, to have a flat top surface, thereby increasing the overall optical efficiency and performance of the array.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method for the manufacture of an array of thin film actuated mirrors for use in an optical projection system, the method comprising the steps of: providing an active matrix; depositing a passivation layer on top of the active matrix, wherein the passivation layer has a top surface; planarizing the top surface of the passivation layer; depositing an etchant stopping layer on the planarized top surface of the passivation layer; forming a thin film sacrificial layer having an array of empty cavities on top of the etchant stopping layer; forming an array of actuating structures on top of the thin film sacrificial layer including the empty cavities, each of the actuating structures including a first thin film electrode, a thin film electrodisplacive member, a second thin film electrode and an elastic member; and removing the thin film sacrificial layer, thereby forming the array of thin film actuated mirrors.
2. The method of claim 1, wherein the passivation layer is made of phosphor-silicate glass (PSG).
3. The method of claim 1, wherein the passivation layer is made of borophosphor-silicate glass (BPSG).
4. The method of claim 1, wherein the passivation layer is deposited in a thickness of 2-3 μm.
5. The method of claim 1, wherein the passivation layer is deposited by using an atmospheric pressure chemical vapor deposition (APCVD) method.
6. The method of claim 1, wherein the top surface of the passivation layer is planarized by using a chemical mechanical polishing (CMP) method.
7. A method for the manufacture of an array of thin film actuated mirrors for use in an optical projection system, the method comprising the steps of: providing an active matrix; depositing a passivation layer on top of the active matrix, the passivation layer having a top surface; depositing a planarization layer on the top surface of the passivation layer; removing the planarization layer while planarizing the top surface of the passivation layer; forming a thin film sacrificial layer having an array of empty cavities on the planarized top surface of the passivation layer; forming an array of actuating structures on top of the thin film sacrificial layer including the empty cavities, each of the actuating structures including a first thin film electrode, a thin film electrodisplacive member, a second thin film electrode and an elastic member; and removing the thin film sacrificial layer, thereby forming the array of thin film actuated mirrors.
8. The method of claim 7, wherein the planarization layer is deposited by using a spin coating method.
9. The method of claim 8, wherein the planarization layer is made of a viscous polymer.
10. The method of claim 7, wherein the planarization layer is removed while planarizing the top surface of the passivation layer by using a CMP method.
11. The method of claim 7, wherein the planarization layer is removed while planarizing the top surface of the passivation layer by using an etch back method.
12. The method of claim 11, wherein the etch back method for planarizing the top surface of the passivation layer is a plasma etching method employing CF 4 and O 2 plasma.Join the waitlist — get patent alerts
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