Die push-up device

Abstract

A die push-up device used in a bonding machine for semiconductor devices, etc. including a wafer sheet suction assembly and a wafer push-up needle which are moved up and down independently by a suction assembly raising-and-lowering cam and a push-up needle raising-and-lowering cam which are respectively rotated by a suction assembly raising-and-lowering motor and a push-up needle raising-and-lowering motor.

I claim: 
     
       1. A die push-up device comprising a suction assembly, on which a wafer sheet to which dies are bonded is held by suction, and a push-up needle, which is installed inside said suction assembly and pushes said dies upward, said die push-up device being characterized in that said suction assembly and push-up needle are caused to move upward and downward independently by a suction assembly raising-and-lowering cam and a push-up needle raising-and-lowering cam which are respectively rotated by a suction assembly raising-and-lowering motor and a push-up needle raising-and-lowering motor. 
     
     
       2. A die push-up device comprising a suction assembly, on which a wafer sheet to which dies are bonded is held by suction, and a push-up needle, which is installed inside said suction assembly and pushes said dies upward, said die push-up device being characterized in that: said suction assembly is provided on a suction assembly holder,   a raising-and-lowering holder is fastened to said suction assembly holder so as to be moved upward and downward by a suction assembly raising-and-lowering cam which is rotated by a suction assembly raising-and-lowering motor,   said push-up needle is provided on a push-up needle raising-and-lowering shaft which is installed inside said suction assembly holder so that said push-up needle raising-and-lowering shaft is moved upward and downward,   said push-up needle raising-and-lowering shaft is moved upward and downward by a lever which is pivotally installed on said raising-and-lowering holder, and   said lever is moved upward and downward by a push-up needle raising-and-lowering cam which is rotated by a push-up needle raising-and-lowering motor.   
     
     
       3. A die push-up device comprising a suction assembly for suction holding thereon a wafer sheet to which dies are bonded and a push-up needle provided in said suction assembly for pushing said dies so as to separate said dies from said wafer sheet, said device further comprising: a suction assembly driving means for moving said suction assembly in one direction; and   a push-up needle driving means for moving said push-up needle in said one direction, said push-up needle driving means functioning independently from said suction assembly driving means.