Split conductive pad for mounting components to a circuit board

Abstract

A component is mounted to a circuit board using two spaced apart conductive pad portions that make electrical contact with a terminal of the component. The space between the conductive pad portions provides an additional path through which a cleaning solution and debris can flow.

We claim: 
     
       1. A split conductive pad electrically connected to a conductive terminal of a component and thus electrically connected to a single conductive path of a circuit board, said conductive pad comprising a first raised conductive portion, said first raised portion having a first top surface and a first bottom surface and a second raised conductive portion, said second raised portion having a second top surface and a second bottom surface wherein said first and second bottom surfaces are electrically connected to said conductive path in a way that said first conductive portion and said second conductive portion are physically separated and raised above the surface of said conductive path so that said conductive terminal is in simultaneous connection with said first top surface and said second top surface. 
     
     
       2. A split conductor pad assembly to facilitate the cleaning of an assembled circuit board comprising: a) a component having a first conductive terminal and a second conductive terminal;   b) a circuit board having a first conductive path and a second conductive path;   c) a first split conductive pad comprising a first conductive portion and a second conductive portion wherein both first and second conductive portions are electrically connected to said first conductive path in such a manner that said first and second conductive portions do not abut;   d) a second split conductive pad comprising a third conductive portion and a fourth conductive portion wherein both third and fourth conductive portions are electrically connected to said second conductive path in such a manner that said third and forth conductive portions do not abut;   e) connecting means for electrically connecting said first conductive terminal atop said first and second conductive portions;   f) connecting means for electrically connecting said second conductive terminal atop said third and fourth conductive portions; and   g) a plurality of pathways defined between said component and said circuit board;   whereby said pathways provide a means in which a cleaning solution can flow between said component and said circuit board.   
     
     
       3. The semiconductor assembly of claim 2 wherein said connecting means is solder. 
     
     
       4. The semiconductor assembly of claim 2 wherein said cleaning solution is water.