Crosslinking agent and curable composition
Abstract
The invention provides a crosslinking agent comprising a compound having at least two noncyclic acid anhydride groups and represented by the following formula ##STR1## wherein R is a monovalent hydrocarbon group having 2 to 50 carbon atoms, R' is a bivalent hydrocarbon group having 2 to 50 carbon atoms, the hydrocarbon groups R and R' containing or not containing an ether linkage, urethane linkage or ester linkage, and n is an integer of 1 to 500. The invention also provides a curable composition including (A) at least one resin selected from the group consisting of (i) a resin having at least one epoxy group and at least one hydroxyl group in the molecule, (ii) a resin mixture of a resin having at least two epoxy groups in the molecule and a resin having at least two hydroxyl groups in the molecule, and (iii) a resin having at least two epoxy groups in the molecule, and (B) the above-mentioned crosslinking agent.
Claims
exact text as granted — not AI-modifiedWe claim:
1. A curable composition comprising: (A) at least one resin selected from the group consisting of (i) a resin having at least one epoxy group and at least one hydroxyl group in the molecule, (ii) a resin mixture of a resin (ii-1) having at least two epoxy groups in the molecule and a resin (ii-2) having at least two hydroxyl groups in the molecule, and (iii) a resin having at least two epoxy groups in the molecule, and (B) a crosslinking agent having at least two noncyclic acid anhydride groups and represented by the following formula ##STR5## wherein R is a monovalent hydrocarbon group having 2 to 50 carbon atoms, R' is a bivalent hydrocarbon group having 2 to 50 carbon atoms, the hydrocarbon groups R and R' containing or not containing an ether linkage, urethane linkage or ester linkage, and n is an integer of 1 to 500.
2. A composition as defined in claim 1 wherein the resin (i) has 2 to 50 epoxy groups and 2 to 50 hydroxyl groups in the molecule.
3. A composition as defined in claim 1 wherein the resin (i) is about 300 to about 100000 in number average molecular weight,
4. A composition as defined in claim 1 wherein the resin (ii-1) has 2 to 50 epoxy groups in the molecule,
5. A composition as defined in claim 1 wherein the resin (ii-1) is about 300 to about 100000 in number average molecular weight.
6. A composition as defined in claim 1 wherein the resin (ii-2) has 2 to 50 hydroxyl groups in the molecule,
7. A composition as defined in claim 1 wherein the resin (ii-2) is about 300 to about 100000 in number average molecular weight,
8. A composition as defined in claim 1 wherein the resin (iii) has 2 to 50 epoxy groups in the molecule,
9. A composition as defined in claim 1 wherein the resin (iii) is about 300 to about 100000 in number average molecular weight.
10. A composition as defined in claim 1 wherein the ratio of the component (B) to the component (A) is about 1 to 1000 parts by weight of the component (B) per 100 parts by weight of the component (A).
11. A composition as defined in claim 1 wherein a curing catalyst is further added to the component (A) and the component (B).Join the waitlist — get patent alerts
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