Method for manufacturing a circuit board with a plurality of conductive terminal pins

Abstract

A method for manufacturing a circuit board with a plurality of conductive terminal pins includes the steps of: providing a bed with an array of receiving holes formed therein; providing the bed on a vibrating apparatus; placing a plurality of conductive terminal pins on the bed, each of the terminal pins having a shank and an enlarged head; operating the vibrating apparatus to permit insertion of the shank of each of the terminal pins into a respective one of the receiving holes, the enlarged heads of the terminal pins being sized to prevent extension thereof in the respective one of the receiving holes; providing a fiber glass reinforcing plate formed with an array of through-holes; providing a fiber glass circuit board body having a bottom side formed with an array of connectors; superimposing the reinforcing plate and the circuit board body on the bed such that each of the connectors of the circuit board body and the heads of the terminal pins extend in a corresponding one of the through-holes and abut against each other; and heating the bed, the reinforcing plate and the circuit board body under pressure so as to provide a firm bond between the reinforcing plate and the circuit board body and between each of the connectors and the head of a corresponding one of the terminal pins.

I claim: 
     
       1. A method for manufacturing a circuit board with a plurality of conductive terminal pins, said method comprising the steps of: (a) providing a first bed with an array of first receiving holes formed therein;   (b) providing said first bed on a vibrating apparatus;   (c) placing a plurality of conductive terminal pins on said first bed, each of said terminal pins having a shank and an enlarged head;   (d) operating said vibrating apparatus to permit insertion of said shank of each of said terminal pins into a respective one of said first receiving holes in said first bed, said enlarged head of said each of said terminal pins being sized larger than said first receiving holes;   (e) providing a fiber glass reinforcing plate formed with an array of through-holes;   (f) providing a fiber glass circuit board body having a bottom side formed with an array of connectors;   (g) superimposing said reinforcing plate and said circuit board body on said first bed such that each of said connectors of said circuit board body and said head of said each of said terminal pins extend in a corresponding one of said through-holes in said reinforcing plate and abut against each other; and   (h) heating said first bed, said reinforcing plate and said circuit board body under pressure so as to provide a firm bond between said reinforcing plate and said circuit board body and between each of said connectors and said head of a corresponding one of said terminal pins.   
     
     
       2. A method for manufacturing a circuit board with a plurality of conductive terminal pins as claimed in claim 1, further comprising, prior to step (c), a step (b') of providing a positioning plate on top of said first bed, said positioning plate being formed with an array of second receiving holes aligned with said first receiving holes in said first bed, said terminal pins being placed on top of said positioning plate. 
     
     
       3. A method for manufacturing a circuit board with a plurality of conductive terminal pins as claimed in claim 2, wherein said first bed has a top surface formed with a plurality of positioning projections, said positioning plate further having a plurality of first positioning holes formed therein, said step (b') comprising the step of extending said positioning projections of said first bed through a corresponding one of said first positioning holes so as to position said positioning plate on said first bed. 
     
     
       4. A method for manufacturing a circuit board with a plurality of conductive terminal pins as claimed in claim 1, further comprising, prior to step (g), a step (e1) of providing a copper foil on an inner wall of each of said through-holes of said reinforcing plate. 
     
     
       5. A method for manufacturing a circuit board with a plurality of conductive terminal pins as claimed in claim 4, further comprising, after step (e1), a step (e2) of spraying a top face of said reinforcing plate with welding tin on a periphery defining each of said through-holes. 
     
     
       6. A method for manufacturing a circuit board with a plurality of conductive terminal pins as claimed in claim 1, further comprising, prior to step (g), a step (f1) of covering each of said connectors with a layer of tin paste. 
     
     
       7. A method for manufacturing a circuit board with a plurality of conductive terminal pins as claimed in claim 1, wherein said step (g) comprises the steps of: (g1) providing a second bed which has a top surface formed with a plurality of positioning rods;   (g2) providing said reinforcing plate on said second bed, said reinforcing plate having a plurality of second positioning holes formed therein, said positioning rods of said second bed extending through a corresponding one of said second positioning holes so as to position said reinforcing plate on said second bed;   (g3) positioning said circuit board body on said reinforcing plate, said circuit board body having a plurality of third positioning holes formed therein, said positioning rods of said second bed extending through a corresponding one of said third positioning holes so as to position said circuit board body on said reinforcing plate; and   (g4) removing said reinforcing plate and said circuit board body from said second bed and placing said circuit board body and said reinforcing plate on said first bed.