Apparatus for manufacturing semiconductor lead frames in a circular path

Abstract

An apparatus for processing semiconductor lead frames is described which comprises a plurality of stations arranged in a substantially circular path for processing the lead frames. The apparatus further includes processing means located at each station for processing the lead frames and transferring means for transferring the lead frames between stations for processing. The processing means includes a removable die module for housing tool kits which work the lead frames and which can be replaced to process different types of lead frames or to produce a different product from the lead frames.

What is claimed is: 
     
       1. An apparatus for processing semiconductor lead frame comprising: (a) a plurality of stations arranged in a substantially circular path for processing said lead frames;   (b) processing means located at each end of said stations for processing a lead frame, said processing means including a die module removably secured to said stations, said die module comprising a frame defining a plurality of cavities for holding a plurality of tool kits for working on said lead frames; and   (c) transferring means for transferring said lead frames between said stations.   
     
     
       2. An apparatus as in claim 1 further including input means for introducing said lead frames to said apparatus. 
     
     
       3. An apparatus as in claim 2 further including on-loading means for transporting said lead frames from said input means to one of said stations. 
     
     
       4. An apparatus as in claim 1 further including off-loading means for removing said lead frames from said plurality of stations. 
     
     
       5. An apparatus as in claim 1 wherein each of said stations and the processing means associated therewith are of a dimension sufficiently large to be able to process an entire lead frame simultaneously. 
     
     
       6. An apparatus as in claim I wherein each of said processing means at said stations includes means for performing any one of the following tasks: deflashing, dambaring, trimming, forming, marking, stamping, checking, singulating, lead conditioning, assembling, and packaging of said lead frames. 
     
     
       7. An apparatus as in claim 1 wherein said transferring means includes a rotatable mechanism positioned at a point substantially close to the center of said circular path, said mechanism having a plurality of wing arms for rotating said lead frames between said stations, and means for removing said lead frames from said stations and for positioning said lead frames at said stations. 
     
     
       8. An apparatus as in claim 7 wherein said removing and positioning means includes means for raising and lowering said lead frames. 
     
     
       9. An apparatus as in claim 1 further including a computer for controlling said processing. 
     
     
       10. An apparatus as in claim 1 wherein said processing means further includes a top plate, a bottom plate, and a guiding assembly, said top plate, bottom plate, and guiding assembly defining a centrally located cavity for housing said removably secured die module. 
     
     
       11. An apparatus as in claim 1 wherein each of said plurality of tool kits perform any one of the following tasks: deflashing, dambaring, trimming, forming, marking, stamping, checking, singulating, lead conditioning, assembling, and packaging said lead frames. 
     
     
       12. An apparatus as in claim 1 wherein said die module is secured to said station with releasable clamps. 
     
     
       13. An apparatus as in claim 10 wherein said processing means further includes guide pins for securing said top plate and said bottom plate to said station, said guide pins being located to avoid obstructing removal of said die module from said station and positioning of said lead frames at said station. 
     
     
       14. An apparatus as in claim 1 wherein one of said processing stations performs marking of said lead frames. 
     
     
       15. An apparatus for processing semiconductor lead frames comprising: (a) a plurality of stations arranged in a substantially circular path for processing said lead frames;   (b) processing means located at said stations for processing said lead frames, said processing means including a die module removably secured to said stations, said die module comprising a frame defining a plurality of cavities for holding a plurality of tool kits for working on the lead frames; and   (c) transferring means for transferring said lead frames between said stations, said transferring means comprising a rotatable mechanism positioned at a point substantially close to the center of said circular path, said mechanism having a plurality of wing arms for rotating said lead frames between said stations, and means for removing said lead frames from said stations and for positioning said lead frames at said stations, said removing and positioning means including means for raising and lowering said lead frames.   
     
     
       16. An apparatus as in claim 15 further including input means for introducing said lead frames to said apparatus. 
     
     
       17. An apparatus as in claim 15 further including on-loading means for transporting said lead frames from said input means to said plurality of stations. 
     
     
       18. An apparatus as in claim 15 further including on-loading means for removing said lead frames from said plurality of stations.