Integrated circuit package having a cooling mechanism

Abstract

An integrated circuit package having a cooling mechanism according to the present invention comprises a plurality of integrated chips disposed to make a matrix and coolers utilizing jet impingement of liquid coolant for cooling which are positioned corresponding to the integrated circuit chips on a printed circuit board using a holding plate and are pressed against the integrated circuit chips with force at a predetermined level. A cooler comprises a cooling plate in contact with a top face of the applicable integrated circuit chip, a cylinder-shaped housing fixed to the cooling plate, a nozzle inserted to the housing to jet the liquid coolant practically to the center of the cooling plate and a draining tube to drain the liquid coolant impinged into the housing. It further comprises a supplying manifold to distribute the liquid coolant supplied from outside to each of the coolers and a draining manifold to collect and drain the liquid coolant flowing from the rows of coolers, and connecting tubes to connect the supplying manifold and the draining manifold with the coolers and to connect adjacent coolers.

What is claimed is: 
     
       1. An integrated circuit package having a cooling mechanism, comprising: a printed wiring board;   a plurality of integrated circuit chips disposed on said printed wiring board;   cooling means disposed corresponding to said integrated circuit chips for cooling said integrated circuit chips using impinging jet of liquid coolant, wherein said cooling means comprises a cooling plate in contact with the top face of a respective integrated circuit chip,   a cylinder-shaped housing with an end fixed to said cooling plate,   a nozzle inserted into said housing to impinge said liquid coolant to substantially the center of said cooling plate, and   a drain tube disposed to drain said liquid coolant from said housing;     holding means in fixed relationship to said printed wiring board for positioning and holding said cooling means corresponding to said integrated circuit chips, wherein said holding means has positioning holes to hold said cooling means with top parts of said cooling means projecting at positions corresponding to said integrated circuit chips; and   pressing means to press said cooling means against said integrated circuit chips with force of a predetermined level.   
     
     
       2. An integrated circuit package having a cooling mechanism of claim 1, further comprising a frame to support said printed wiring board wherein said holding means is fixed to said frame. 
     
     
       3. An integrated circuit package having a cooling mechanism of claim 1, wherein said pressing means comprises a spring disposed between said cooling means and said holding means. 
     
     
       4. An integrated circuit package having a cooling mechanism of claim 1, further comprising; a supplying manifold, which is provided with an inlet for liquid coolant supplied from outside said integrated circuit package, for distributing the liquid coolant to each of rows of cooling means;   a draining manifold which collects liquid coolant flowing from said rows of cooling means and drain such liquid coolant to outside said integrated circuit package; and   connecting tubes to connect said supplying manifold and draining manifold with the cooling means and to connect adjacent cooling means in each row.   
     
     
       5. An integrated circuit package having a cooling mechanism, comprising; a printed wiring board;   a plurality of integrated circuit chips disposed on said printed wiring board in a matrix;   cooling means, disposed corresponding to said integrated circuit chips, for cooling said integrated circuit chips using jet impingement of liquid coolant, wherein said cooling means comprises a cooler plate in contact with the top face of a respective integrated circuit chip,   a cylinder-shaped housing with an end fixed to said cooler plate,   a nozzle inserted into said housing to jet said liquid coolant to substantially the center of said cooler plate, and   a drain tube disposed at said housing to drain said liquid coolant jet into said housing;     holding means, in fixed relationship to said printed wiring board, for positioning and holding said cooling means corresponding to said integrated circuit chips, wherein said holding means has positioning holes to hold said cooling means with their top part projecting at the positions corresponding to said integrated circuit chips;   pressing means for pressing said cooling means against said integrated circuit chips with force of a predetermined level;   a supplying manifold which is provided with an inlet for liquid coolant supplied from outside said integrated circuit package and distributes the liquid coolant to each row of cooling means;   a draining manifold which collects the liquid coolant flowing from said rows of cooling means and is provided with an outlet to drain such liquid coolant; and   connecting tubes to connect said supplying manifold and draining manifold with the rows of cooling means and to connect adjacent cooling in each row.   
     
     
       6. An integrated circuit package having a cooling mechanism of claim 5, further comprising a frame to support said printed wiring board wherein said holding means is fixed to said frame. 
     
     
       7. A cooling device in an integrated circuit package, comprising; cooling means, which are disposed corresponding to a plurality of integrated circuit chips mounted on a printed wiring board in an integrated circuit package, for cooling said integrated circuit chips using jet impingement of liquid coolant, wherein said cooling means comprises a cooling plate in contact with the top face of a respective integrated circuit chip, a cylinder-shaped housing with an end fixed to said cooling plate, a nozzle inserted into said housing to impinge said liquid coolant to substantially the center of said cooler plate, and a drain tube disposed at said housing to drain said liquid coolant jet into said housing;   holding means, in fixed relationship to said printed wiring board, for positioning and holding said cooling means corresponding to said integrated circuit chips wherein said holding means has positioning holes to hold said cooling means with their top part projecting at the positions corresponding to said integrated circuit chips;   pressing means for pressing said cooling means against said integrated circuit chips with force of a predetermined level;   a supplying manifold which is provided with an inlet for liquid coolant supplied from outside said integrated circuit package for distributing the liquid coolant to each row of cooling means;   a draining manifold which collects the liquid coolant flowing from said rows of cooling means and is provided with an outlet to drain such liquid coolant; and   connecting tubes to connect said supplying manifold and draining manifold with the rows of cooling means and to connect adjacent cooling means in each row.   
     
     
       8. An integrated circuit package having a cooling mechanism of claim 7, further comprising a frame to support said printed wiring board wherein said holding means is fixed to said frame.