Backplane interconnection system

Abstract

A backplane interconnection system for interconnecting an array of electronic components, such as integrated-circuit (IC) chip packages mounted on multilayer printed circuit boards. The backplane interconnection system includes an interface board and one or more interconnecting circuit board and a plurality of insulating boards arranged on a heat sink. The interconnecting circuit boards and the insulating boards are alternately interposed between the interface board and the array of electronic components such that an insulating board is positioned adjacent both the interface board and adjacent the array of electronic components. Connector elements disposed in selected openings of the insulating boards make electrical connections between contact areas on the interconnecting boards, the electronic components and the interface board. Any modification to an electronic component, such as a change in the input/output configuration of an IC chip package and its circuit board, can be readily accommodated by rearranging the connector elements in the insulating boards and/or replacing one or more of the interconnecting circuit boards.

I claim: 
     
       1. A backplane interconnection system, comprising: an interface board having contact areas on both surfaces of the interface board and selected connections between the contact areas;   a plurality of interconnecting circuit boards, each interconnecting circuit board having contact areas on both surfaces of the interconnecting circuit board and selected connections between the contact areas;   a plurality of insulating boards, the insulating boards and the interconnecting circuit boards being alternately arranged with an insulating board positioned adjacent the interface board, each insulating board having openings at positions corresponding to the contact areas;   a plurality of conductive connector elements disposed in selected ones of the openings in the insulating boards for making electrical contact between the contact areas; and   one or more strip transmission lines and one or more microstrip transmission lines formed on one or more of the interconnecting circuit boards;   wherein a compressive force applied to the interface board, the interconnecting circuit boards and the insulating boards forces the connector elements into contact with the contact areas.   
     
     
       2. The backplane interconnection system as set forth in claim 1, wherein each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas. 
     
     
       3. The backplane interconnection system as set forth in claim 2, wherein the insulating boards are fabricated from a glass ceramic. 
     
     
       4. The backplane interconnection system as set forth in claim 2, wherein each wadded strand of wire has a density of approximately 20 to 50 percent. 
     
     
       5. The backplane interconnection system as set forth in claim 1, wherein some of the interconnecting circuit board contact areas and some of the connector elements are formed in coaxial-shaped configurations for electrically interconnecting the strip and microstrip transmission lines. 
     
     
       6. The backplane interconnection system as set forth in claim 5, wherein each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas. 
     
     
       7. The backplane interconnection system as set forth in claim 6, wherein each wadded strand of wire has a density of approximately 20 to 50 percent. 
     
     
       8. The backplane interconnection system as set forth in claim 6, wherein the insulating boards are fabricated from a glass ceramic. 
     
     
       9. A backplane interconnection system, comprising: an array of electronic components having contact areas;   an interface board having contact areas on both surfaces of the interface board and selected connections between the contact areas;   a plurality of interconnecting circuit boards, each interconnecting circuit board having contact areas on both surfaces of the interconnecting circuit board and selected connections between the contact areas;   a plurality of insulating boards, the insulating boards and the interconnecting circuit boards being alternately interposed between the interface board and the array of electronic components such that an insulating board is positioned adjacent the interface board and adjacent the array of electronic components, each insulating board having openings at positions corresponding to the contact areas;   a plurality of conductive connector elements disposed in selected ones of the openings in the insulating boards for making electrical contact between the contact areas; and   one or more strip transmission lines and one or more microstrip transmission lines formed on one or more of the interconnecting circuit boards;   wherein a compressive force applied to the interface board, the interconnecting circuit boards, the insulating boards and the array of electronic components forces the connector elements into contact with the contact areas.   
     
     
       10. The backplane interconnection system as set forth in claim 9, wherein some of the interconnecting circuit board contact areas and some of the connector elements are formed in coaxial-shaped configurations for electrically interconnecting the strip and microstrip transmission lines with coaxial-shaped contact areas on the array of electronic components. 
     
     
       11. The backplane interconnection system as set forth in claim 10, wherein each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas. 
     
     
       12. The backplane interconnection system as set forth in claim 11, wherein each wadded strand of wire has a density of approximately 20 to 50 percent. 
     
     
       13. The backplane interconnection system as set forth in claim 11, wherein the insulating boards are fabricated from a glass ceramic. 
     
     
       14. The backplane interconnection system as set forth in claim 9, wherein the array of electronic components includes a plurality of IC chip packages that are mounted on multilayer printed circuit boards. 
     
     
       15. The backplane interconnection system as set forth in claim 9, wherein the array of electronic components has a plurality of surface contact areas for making electrical contact with the connector elements in an adjacent insulating board. 
     
     
       16. The backplane interconnection system as set forth in claim 15, wherein the array of electronic components further includes interconnecting circuit boards and insulating boards having connector elements for electrically interconnecting the surface contact areas of the electronic components with the connector elements in an adjacent insulating board. 
     
     
       17. The backplane interconnection system as set forth in claim 16, wherein each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas. 
     
     
       18. The backplane interconnection system as set forth in claim 9, wherein the array of electronic components has a plurality of edge contact areas for making electrical contact with the connector elements in an adjacent insulating board. 
     
     
       19. The backplane interconnection system as set forth in claim 9, wherein each of the connector elements includes a wadded strand of conductive wire that is deformed when compressed between the contact areas and makes multiple electrical contacts between the contact areas.