Stadium-stepped package for an integrated circuit with air dielectric

Abstract

A package for containing an integrated circuit component is provided which includes one or more layers with exposed edges surrounding a central opening. The integrated circuit component is positioned in the central opening. Bond wires connect the bond pads of the integrated circuit component to the continuous shelves of the various stepped-back stadium-like layers as well as to individual insulated leads. The layers are spaced apart by beads or columns of insulative material and the major portion of the layers are separated from each other by a gaseous dielectric, preferably air. The R-C constant is reduced and the speed of transmission is increased by the presence of the low dielectric material providing a device which can function rapidly. The stepped portions of the layers are exposed to allow for electrical interconnections within the layers, as well as from each layer to the integrated circuit.

What is claimed is: 
     
       1. A package for an integrated circuit component, the component having a plurality of contact pads on its surface, the package comprising: means for supporting said integrated circuit component;   a first layer, connected to said means for supporting, having at least a first electrically conductive portion;   a second layer with at least a first edge, said second layer having at least a first area which overlies and is spaced from said first layer, said second layer having at least a second electrically conductive portion;   means for providing electrical connection between at least one of said contact pads and at least one of said first electrically conductive portion and said second electrically conductive portion; and   at least a first dielectric material positioned between said first area and said at least part of said first layer, wherein said first dielectric material is a gaseous material.   
     
     
       2. A package, as claimed in claim 1, wherein said gaseous material is air. 
     
     
       3. A package, as claimed in claim 1, wherein said first dielectric material separates said first electrically conductive portion of said first layer from the major part of said second electrically conductive portion of said second layer. 
     
     
       4. A package, as claimed in claim 1, wherein the surface area of said first layer is greater than the surface area of said second layer, and wherein part of said first layer extends laterally beyond said edge of said second layer. 
     
     
       5. A package, as claimed in claim 1, wherein at least one of said first and said second layers includes a plurality of leads electrically insulted from one another. 
     
     
       6. A package, as claimed in claim 1, wherein at least one of said first and said second layers is a planar electrically conductive sheet. 
     
     
       7. A package, as claimed in claim 1, further comprising: a second dielectric material positioned between said first layer and said second layer to maintain said first and second layers in a spaced-apart configuration.   
     
     
       8. A package, as claimed in claim 1, where said first and second layers are spaced apart a distance of less than about 0.006 inches. 
     
     
       9. A package usable for providing electrical connections between an integrated circuit component and another electrical component, the package comprising: a base layer having means for supporting an integrated circuit component;   a first layer having a first central opening, said first opening having at least a first edge, said first layer positioned overlying and spaced from said base layer, said first central opening substantially aligned with said means for supporting an integrated circuit, said first layer including a substantially planar electrically conductive first region adjacent to at least a portion of said first edge;   a second layer lying substantially in a plane, selected from a lead frame and a metalized substrate, defining a second central opening, said second opening having at least a second edge, at least a portion of said second opening substantially aligned with said first opening, said second layer including a plurality of electrically conductive leads which are electrically insulated from one another, at least a portion of said leads extending in a direction outward from said central opening to provide for electrical connection of said package to said other electrical component, at least a first of said leads terminating at said second edge, wherein all leads in said package have at least a portion lying in the plane of said second layer;   first interconnect means for providing electrical connection between said integrated circuit component and said first edge;   second interconnect means for providing electrical connection between said integrated circuit component and at least said first lead; and   third interconnect means for providing electrical connection between said first region and at lest one of said plurality of leads adjacent said second edge, in the absence of vias.   
     
     
       10. A package, as claimed in claim 9, wherein said first layer is a ground plane for providing a first voltage to said integrated circuit component. 
     
     
       11. A package, as claimed in claim 10, further comprising: a power plane spaced from said ground plane, for providing a second voltage to said integrated circuit component, said power plane having a third central opening, at least a portion of said third opening being substantially aligned with said first central opening, said third opening having a third edge;   interconnect means for providing electrical connection between said third edge and said integrated circuit component.   
     
     
       12. A package, as claimed in claim 9, wherein said base layer has a thermal conductivity greater than about 2 watt cm -1 . K -1  and wherein said integrated circuit component is mounted directly on said base layer to provide heat transfer to said base layer. 
     
     
       13. A package, as claimed in claim 9, wherein said base layer comprises at least 95 weight percent copper. 
     
     
       14. A package for an integrated circuit component having a plurality of contact pads along its periphery, comprising: an electrically conductive base means for supporting an integrated circuit component;   an electrically conductive first layer separated from and secured to said base means by selectively disposed insulating material such that an open region is formed between the base member and the first layer so as to allow air in the open region to act as a dielectric insulator between the first layer and the base means, the first layer having a central opening therein to expose a central portion of the base means to which the integrated circuit component is to be attached;   an electrically conductive second layer separated from and secured to said first layer by selectively disposed insulating material such that an open region is formed between the second layer and the first layer so as to allow air in the open region to act as a dielectric insulator between the second layer and the first layer, the second layer having a central opening therein, larger than the central opening in the first layer, to expose a portion of the first layer and to expose the central portion of the base means to which the integrated circuit component is to be attached;   an electrically conductive third layer separated from and secured to said second layer by selectively disposed insulating material such that an open region is formed between the third layer and the second layer so as to allow air in the open region to act as a dielectric insulator between the third layer and the second layer, the third layer comprising a plurality of conductive chip connection leads extending from an interior portion so as to define a central opening, larger than the central opening in the second layer, to expose a portion of the first and second layers and to expose the central portion of the base means to which the integrated circuit component is to be attached, to an exterior position beyond the periphery of the base for connecting to external circuitry; and   a lid separated from and secured to said third layer by selectively disposed insulating material.   
     
     
       15. A package, as claimed in claim 14, wherein said first layer is electrically connected to said integrated circuit component for providing a ground voltage thereto, and further comprising: an electrically conductive fourth layer secured between said second layer and said third layer and separated therefrom by selectively disposed insulating material such that an open regions are formed between said second layer and said fourth layer and between said fourth layer and said third layer so as to allow air in the open regions to act as a dielectric insulator between the second and fourth layers and the fourth and third layers, the fourth layer having a central opening therein to expose the central portion of the base member to which the integrated circuit is to be attached, said fourth layer electrically connected to said integrated circuit component for providing a power voltage thereto.   
     
     
       16. A package useful for providing electrical connections between an integrated circuit component and another electrical component, the package comprising: a base layer having means for supporting an integrated circuit component; and   a lead frame coupled to said base layer, including a plurality of electrically conducting leads which are electrically insulated from one another, at least a first portion of said leads lying substantially in a first plane and extending in a direction outward from the edge of said base layer to provide for electrical connection of said package to said other electrical component, at least a first of said leads having a first thickness, in a direction traverse to said first plane, in said first portion, and having a second thickness, in a direction traverse to said first plane, in a second portion, said second portion being closer to said means for supporting than said first portion, said second thickness being less than said first thickness.