US4964198AExpiredUtility

V-shaped clip for attaching a semiconductor device to a heat sink

Assignee: AVVID ENGINEERING INCPriority: Sep 21, 1988Filed: Sep 21, 1988Granted: Oct 23, 1990
Est. expirySep 21, 2008(expired)· nominal 20-yr term from priority
H10W 40/641Y10T24/44026
54
PatentIndex Score
23
Cited by
4
References
5
Claims

Abstract

A resilient spring clip for attaching a semiconductor to a heat sink comprising a first surface and an attachment means, the attachment means comprising a pair of V-shaped legs adapted to fit into and be secured to a slot in a heat sink so that the first surface spring-engages the semiconductor and holds it to the heat sink, the clip taking up little extra space.

Claims

exact text as granted — not AI-modified
What I claim is: 
     
       1. A clip for attaching a semiconductor to a heat sink comprising: a first surface, said first surface having a flat section with a pair of sidewalls extending downwardly therefrom so as to define an opening adapted to receive a semiconductor when said clip is in use wherein said flat section contacts the semiconductor which is held in place by said sidewalls,   said flat section being connected to an upwardly angled spring section,     an attachment means, said attachment means connected to said spring section of said first surface, said attachment means comprising a V-shaped portion having at least a first and a second leg, said legs being joined at one end to form an apex and being spaced apart at their opposite ends,   said V-shaped portion having a connecting leg, said connecting leg being attached to said spring section,   said V-shaped portion having lip means and shelf means which are spaced apart,   whereby when said clip is in use said V-shaped portion, which si resilient, is compressed so as to insert it into a slot in the heat sink, so that when said V-shaped portion is allowed to flex back to is normal position, the portion of the heat sink adjacent to the slot is secured between said lip means and said shelf means and as a result when a semiconductor is placed in said opening, said spring section forces said flat section in a direction parallel to said V-shaped portion against said semiconductor to hold it in place on the heat sink.     
     
     
       2. The clip of claim 1 wherein said lip means comprises a first lip, said first lip extending from one end of said first leg opposite said apex. 
     
     
       3. The clip of claim 2 wherein said lips means comprises a second lip, said second lip extending from one end of said second leg opposite said apex, said second lip being parallel to said first lip. 
     
     
       4. The clip of claim 3 wherein said shelf means comprises a shelf disposed on said first leg parallel to but spaced apart from said first lip means thereby forming a space for holding a portion of the heat sink. 
     
     
       5. The clip of claim 4 wherein said first lip is connected to said connecting leg which is perpendicular to it, said connecting leg being attached to said spring portion at the end opposite said first lip.

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