US4962876AExpiredUtility

Method of producing a movable part of a wire-dot print head

Assignee: OKI ELECTRIC IND CO LTDPriority: Mar 14, 1988Filed: Mar 3, 1989Granted: Oct 16, 1990
Est. expiryMar 14, 2008(expired)· nominal 20-yr term from priority
B41J 2/235
69
PatentIndex Score
16
Cited by
8
References
9
Claims

Abstract

In a method of producing a movable part of a wire-dot print head comprising an armature supported by a plate spring, and a lever having a tip to which print wire is fixed, the armature and the lever are formed of alloys containing identical atoms or alloys easy to diffuse into each other, a bond part of a base part of the lever is inserted in a bond groove in a tip of the armature, and the lever and the armature are heat-treated in vacuum at a temperature not lower than 1100° C. and below the melting points of the lever and the armature, so that the lever and the armature are diffusion-bonded.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A method of producing a movable part of a wire-dot print head comprising an armature supported by a plate spring, and a lever having a tip to which print wire is fixed, said method comprising the steps of: forming the armature and the lever;   inserting a bond part of a base part of the lever in a bond groove provided in a tip of the armature; and   heat-treating the lever and the armature in vacuum, so that the lever and the armature are diffusion-bonded;   wherein said armature and said lever are formed of materials easy to diffuse into each other at the temperature of the heat treatment for the diffusion.   
     
     
       2. A method according to claim 1, wherein said armature and said lever are formed of materials having diffusion coefficients of not less than about 1×10 -14  m 2  /sec. at the temperature of the heat treatment for the diffusion. 
     
     
       3. A method according to claim 1, wherein said armature and said lever are formed of materials containing identical atoms. 
     
     
       4. A method according to claim 1, wherein said armature and said lever are formed of alloys containing identical metal atoms. 
     
     
       5. A method according to claim 1, wherein the temperature of the heat treatment for the diffusion is not lower than about 1100° C. and below the melting points of the materials of said lever and said armature. 
     
     
       6. A method according to claim 1, wherein said bond part is pressure-inserted in said bond groove so that the bond part receives the pressure of about 0.3 to 0.5 kgf/cm 2  from the bond groove. 
     
     
       7. A method according to claim 1, wherein said bond part is plate-shaped, and said bond groove is a slit having a width corresponding to the thickness of the plate-shaped bond part. 
     
     
       8. A method according to claim 1, wherein said armature is formed of silicon steel and said lever is formed of SK steel. 
     
     
       9. A method according to claim 1, wherein said armature is formed of high-density magnetic flux material containing cobalt such as Permendur, and said lever is formed of maraging steel, titanium alloy or Elgiloy.

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