US4962876AExpiredUtility
Method of producing a movable part of a wire-dot print head
Est. expiryMar 14, 2008(expired)· nominal 20-yr term from priority
B41J 2/235
69
PatentIndex Score
16
Cited by
8
References
9
Claims
Abstract
In a method of producing a movable part of a wire-dot print head comprising an armature supported by a plate spring, and a lever having a tip to which print wire is fixed, the armature and the lever are formed of alloys containing identical atoms or alloys easy to diffuse into each other, a bond part of a base part of the lever is inserted in a bond groove in a tip of the armature, and the lever and the armature are heat-treated in vacuum at a temperature not lower than 1100° C. and below the melting points of the lever and the armature, so that the lever and the armature are diffusion-bonded.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method of producing a movable part of a wire-dot print head comprising an armature supported by a plate spring, and a lever having a tip to which print wire is fixed, said method comprising the steps of: forming the armature and the lever; inserting a bond part of a base part of the lever in a bond groove provided in a tip of the armature; and heat-treating the lever and the armature in vacuum, so that the lever and the armature are diffusion-bonded; wherein said armature and said lever are formed of materials easy to diffuse into each other at the temperature of the heat treatment for the diffusion.
2. A method according to claim 1, wherein said armature and said lever are formed of materials having diffusion coefficients of not less than about 1×10 -14 m 2 /sec. at the temperature of the heat treatment for the diffusion.
3. A method according to claim 1, wherein said armature and said lever are formed of materials containing identical atoms.
4. A method according to claim 1, wherein said armature and said lever are formed of alloys containing identical metal atoms.
5. A method according to claim 1, wherein the temperature of the heat treatment for the diffusion is not lower than about 1100° C. and below the melting points of the materials of said lever and said armature.
6. A method according to claim 1, wherein said bond part is pressure-inserted in said bond groove so that the bond part receives the pressure of about 0.3 to 0.5 kgf/cm 2 from the bond groove.
7. A method according to claim 1, wherein said bond part is plate-shaped, and said bond groove is a slit having a width corresponding to the thickness of the plate-shaped bond part.
8. A method according to claim 1, wherein said armature is formed of silicon steel and said lever is formed of SK steel.
9. A method according to claim 1, wherein said armature is formed of high-density magnetic flux material containing cobalt such as Permendur, and said lever is formed of maraging steel, titanium alloy or Elgiloy.Join the waitlist — get patent alerts
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