Equipment for thermal stabilization process of photoresist pattern on semiconductor wafer

Abstract

An equipment (100; 200) for thermal stabilization process of photoresist pattern on semiconductor wafer comprises an ultraviolet lamp (20) by which a photoresist pattern formed on a semiconductor wafer (W) put in a process chamber (S) under vacuum pressure is irradiated with ultraviolet rays of a predetermined strength, and a heater (10) for heating the wafer to a predetermined temperature.

We claim: 
     
       1. An equipment for thermal stabilization process of photoresist pattern on semiconductor wafer, comprising: a hermetically sealable process chamber in which a semiconductor wafer formed with a photoresist pattern is put;   an ultraviolet lamp for irradiating said photoresist pattern with ultraviolet rays of a predetermined strength;   a means for reducing the inner pressure of said process chamber to a predetermined value; and   a means for heating said semiconductor wafer to a predetermined temperature.   
     
     
       2. An equipment for thermal stabilization process according to claim 1, wherein: said equipment further comprises a table with an opening formed therethrough, a stage on which said semiconductor wafer is put and which hermetically closes the aperture at one end of said opening, and a chamber cover for hermetically closing the aperture at the other end of said opening;   said process chamber is defined by cooperation of said opening of said table, said stage, and said chamber cover;   said reducing means comprises a suction path formed in said table in communication with said process chamber, and a suctioning means connected to said suction path; and   said heating means comprises a heater built in said stage.   
     
     
       3. An equipment for thermal stabilization process according to claim 2, wherein: said chamber cover comprises a transparent plate;   said ultraviolet lamp is disposed outside of said transparent plate; and   said table is formed with a communication path for selectively connecting said process chamber to an inert gas feed line and a purge line.   
     
     
       4. An equipment for thermal stabilization process according to claim 3, further comprising: a shutter interposed between said ultraviolet lamp and said chamber cover.   
     
     
       5. An equipment for thermal stabilization process according to claim 2, wherein: said ultraviolet lamp is disposed in said process chamber; and   said chamber cover is provided with an admission pipe for selectively connecting said process chamber to an inert gas feed line and a purge line.   
     
     
       6. An equipment for thermal stabilization process according to claim 2, further comprising: a control system including an illumination monitor for monitoring an illumination strength of said ultraviolet lamp, and a control unit for computing a process time to thereby automatically control the operation of said shutter and the transfer of said semiconductor wafer.