Tarnish remover/metal polish formulation comprising a metal iodide, an acid, and water

Abstract

A tarnish remover/metal polish formulation comprising water, an acid, and metal iodide, such as potassium iodide, is described. The components of the formulation chemically react with the tarnish or stain on a metal surface, removing the tarnish or stain while leaving the metal unaffected. The tarnish remover/metal polish can be applied as a dip-rinse or as a polish. The composition is easily applied and easily removed.

It is claimed: 
     
       1. An improved tarnish remover/metal polish formulation comprising: (a) at least one metal iodide in an amount of from about 8 to 25% by weight;   (b) an acid in an amount of from about 0.1 to 25% by weight;   (c) a surfactant in an amount of from about 0.5 to 3% by weight, and;   (d) the balance water.   
     
     
       2. The improved tarnish remover/metal polish formulation of claim 1 wherein the metal iodide is a member of the group consisting of potassium iodide, sodium iodide, lithium iodide, magnesium iodide, calcium iodide, rubidium iodide, cesium iodide, and mixtures thereof. 
     
     
       3. The improved tarnish remover/metal polish formulation of claim 2 wherein the metal iodide is potassium iodide. 
     
     
       4. The improved silver polish formulation of claim 1 wherein said acid is phosphoric acid which is present at from about 3 to 8% by weight. 
     
     
       5. The improved silver polish formulation of claim 1 wherein said acid is citric acid which is present at from about 3 to 8% by weight. 
     
     
       6. The improved silver polish formulation of claim 1 wherein said acid is sulfuric acid which is present at from about 3 to 8% by weight. 
     
     
       7. The improved silver polish formulation of claim 1 wherein said acid is sulfonic acid which is present at from about 3 to 8% by weight. 
     
     
       8. The improved tarnish remover/metal polish formulation of claim 1 wherein said potassium iodide is present at from about 8 to 15% by weight. 
     
     
       9. The metal polish of claim 1 including in addition to said essential ingredients a thickening agent. 
     
     
       10. The metal polish of claim 1 including in addition to said essential ingredients an organic solvent. 
     
     
       11. An improved tarnish remover/metal polish formulation suitable as dip rinse comprising: (a) from about 3 to 6% by weight of an acid,   (b) from about 8 to 15% by weight of a metal iodide,   (c) a surfactant in an amount of about 0.5 to 3% by weight; and   (d) the balance water.   
     
     
       12. The improved tarnish remover/metal polish formulation of claim 11 wherein the metal iodide is a member of the group consisting of potassium iodide, sodium iodide, lithium iodide, magnesium iodide, calcium iodide, rubidium iodide, cesium iodide, and mixtures thereof. 
     
     
       13. The improved tarnish remover/metal polish formulation of claim 12 wherein the metal iodide is potassium iodide. 
     
     
       14. An improved tarnish remover/metal polish formulation suitable for use as a metal polish comprising from about 3 to 6% by weight of an acid, 8 to 15% by weight of a metal iodide, 4 to 15% of an abrasive, 0.5 to 3% of a surfactant, and the balance water. 
     
     
       15. The improved tarnish remover/metal polish formulation of claim 14 wherein the metal iodide is a member of the group consisting of potassium iodide, sodium iodide, lithium iodide, magnesium iodide, calcium iodide, rubidium iodide, cesium iodide, and mixtures thereof. 
     
     
       16. The improved tarnish remover/metal polish formulation of claim 15 wherein the metal iodide is potassium iodide. 
     
     
       17. The metal polish of claim 1 including in addition to said essential ingredients an abrasive.