Test socket for a leadless chip carrier

Abstract

A socket is provided for testing leadless chip carriers. The socket has a base with a resilient pad. A planar assembly of coaxial cables is positioned above the base so that a terminal contact of each cable is located on the resilient pad in alignment with the contacts on the chip carrier. A frame is coupled to the planar assembly of coaxial cables and to the base. The frame has an opening for receiving and aligning the contacts of the carrier with the contacts of each coaxial cable. The socket has a cover which is hinged and latched to the base. A screw threaded through the cover is used to apply pressure to the carrier in the socket.

What is claimed is: 
     
       1. A test socket for a high frequency leadless chip carrier, comprising: a base;   a cover coupled to and spaced from said base;   a frame coupled to said base, said frame having an opening to receive and position the chip carrier;   a planar assembly of coaxial cables having contacts at one end, said planar assembly being coupled to said frame;   a resilient pad supported by said base within said opening and positioned under said coaxial cable contacts in line with the corresponding contacts of the chip carrier so that said coaxial cable contacts can be compressed against the corresponding contacts of the chip carrier in a planar manner; and   means connected to said cover for compressing the contacts of the leadless chip carrier against said contacts of said coaxial cables.   
     
     
       2. The socket as claimed in claim 1 including: two alignment holes in said frame;   two threaded alignment holes in said base corresponding to said alignment holes in said frame; and   screws extending through said alignment holes and into said threaded holes in said base.   
     
     
       3. The socket as claimed in claim 1, wherein said means for compressing the contacts comprises a threaded hole in said cover and a screw extending through said threaded hole in a position to bear against the top of said chip carrier. 
     
     
       4. The socket as claimed in claim 1, wherein said means for compressing comprises a spring under said cover. 
     
     
       5. The socket as claimed in claim 1, including a hinge coupling one end of said cover to said base and a latch coupling the other end of said cover to said base. 
     
     
       6. A socket for a high frequency leadless chip carrier comprising: a base;   a cover having a hinge and a latch for coupling said cover to said base;   means connected to said cover for applying pressure to the chip carrier when it is positioned in the socket;   a frame coupled to said base, said frame having an opening to receive and position the chip carrier;   a planar assembly of coaxial cables having contacts extending out from one end, said assembly being coupled to said frame; and   a resilient pad supported by said base within said opening and positioned under said coaxial cable contacts in line with the corresponding contacts of the chip carrier, so that said coaxial cable contacts can be compressed against the corresponding contacts of the chip carrier in a planar manner by said means for applying pressure.