Epoxy resin compositions of enhanced creep resistance

Abstract

A room temperature aged epoxy resin grout utilizing a mixture of the diglycidyl ether of bis-phenol A and a siliceous aggregate such as sand is markedly improved in creep deformation performance when a reactive diluent such as the diglycidyl ether of cyclohexane dimethanol and a curing agent such as triethylene tetraamine are admixed with said grout.

What is claimed is: 
     
       1. An epoxy resin composition comprising: (a) an epoxy resin having at least two ##STR3##  groups per molecule; (b) a diglycidyl ether of cyclohexane dimethanol;   (c) triethylene tetraamine in a sufficient amount to cure said epoxy resin at about room temperature; and,   (d) a major amount of an aggregate filler having a particulate size ranging from 5 to 400 mesh.   
     
     
       2. An epoxy resin composition comprising: (a) a diglycidyl ether of bisphenol A;   (b) a diglycidyl ether of cyclohexane dimethanol in an amount ranging from 0.3 to 1 part by weight per weight part of said diglycidyl ether of bisphenol A;   (c) at least an effective amount of triethylene tetraamine; and,   (d) from 4.5 to 5.5, parts by weight of a siliceous aggregate per part by weight of the combined weight of (a), (b) and (c).   
     
     
       3. An epoxy resin composition according to claim 2 wherein said diglycidyl ether of cyclohexane dimethanol is present in an amount of 0.5 part by weight per weight part of said diglycidyl ether of bisphenol A. 
     
     
       4. An epoxy resin composition according to claim 1 wherein said filler is a siliceous aggregate consisting of silica sand and silica flour. 
     
     
       5. An epoxy resin composition according to claim 1 wherein said filler is an amino silane treated siliceous aggregate. 
     
     
       6. An epoxy resin according to claim 2 wherein there is 5 parts by weight of said siliceous aggregate per part by weight of said combined weight. 
     
     
       7. An epoxy resin composition according to claim 1 comprising: (a) from 10 to 20 weight percent of said epoxy resin diluted with about 0.5 part by weight per part by weight of said resin of the diglycidyl ether of cyclohexane dimethanol and at least an effective amount of triethylene tetraamine to cure said epoxy resin at about room temperature; and,   (b) from 80 to 90 part by weight of a siliceous aggregate having a particulate size ranging from 8 to 400 mesh with from 20 to 30 weight percent of siliceous aggregate having a particulate size ranging from 100 to 400 mesh, said weight percent being based on the total weight of said composition.