Mounting of a compact circuit package to a heat sink or the like

Abstract

A compact circuit package includes a housing providing a cavity for containing heat generating electrical components. A ceramic substrate is mounted to close the cavity. The package is adapted to be mounted in heat transferring relationship with a heat sink. The bottom surface of the compact circuit package is provided with a self-contained chamber containing a supply of grease. The chamber is defined by the package bottom surface and a bubble of plastic film which overlies the substrate and which is removable sealed to the package around the periphery of the substrate. In this form, the compact circuit package can be transported and stored until ready for use. When the package is ready to be mounted to a heat sink, pressure such as by a finger is applied to the top surface of the bubble film to thereby spreadingly apply the grease to the surface of the substrate. The film is then removed from the bottom of the compact circuit package and the greasey underside of the film placed into engagement with the heat sink surface and rubbed, as by a finger, to thereby spread the remaining residue grease onto the heat sink. The film is then removed and discarded and the compact circuit package mounted to the heat sink.

I claim: 
     
       1. A compact circuit package mounted in heat transferring relation to the wall of a heat sink, comprising, in combination: (a) a housing having a cavity containing heat generating electrical components,   (b) the lower portion of said housing providing a peripheral rim surrounding said cavity,   (c) an electrical insulating heat conducting substrate surrounded by said rim and closing said cavity,   (d) a bubble of plastic film secured to said housing and overlying said substrate, said housing with said film forming an enclosed chamber,   (e) heat transferring grease disposed in said chamber for spreading in a layer onto said substrate upon the application of external pressure to said film,   (f) said film being removable from said housing so that said layer of grease on said substrate is exposed in subsequent contact with the wall of said heat sink.   
     
     
       2. The package of claim 5 wherein said film comprises means retaining a residue of grease on its underside after said removal from said housing for application of a further layer of grease to the wall of a heat sink. 
     
     
       3. The package of claim 6 in which said film is initially adhesively secured to said rim of said housing and is peelable therefrom to expose said layer of grease on said substrate. 
     
     
       4. The package of claim 3 in which said heat transferring grease is initially disposed in said enclosed chamber in the form of spaced deformable nodules spread out into a layer by pressing down on said film at said nodules.