Installation for assembling electronic components

Abstract

An endless belt (1) transports supports (6) on which electronic components have been placed. The supports have a layer of solder which is to be melted to make electrical contact with the components assembled thereon. A hot plate (8) is arranged at the downstream end of the belt (1). In order to ensure uniform heating of the supports through the belt, the hot plate is provided with openings (10) in its plane, belt-contacting surface. The openings are connected to a vacuum pump (16) and the vacuum keeps the belt in intimate contact with the hot plate. The installation is particularly intended for use in assembling hybrid micro-circuits, whether using thin film technology or thick film technology.

I claim: 
     
       1. An installation for assembling electronic components on a support and for soldering the components to the support by re-melting a layer of metal previously deposited on the support, the installation comprising an imperforate endless conveyor belt on which the component-bearing supports are placed, and at least one hot plate having a plane surface over which the belt slides, wherein the improvement comprises a plurality of ducts within the body of the hot plate, each duct having one end opening onto said plane surface, and a vacuum pump connected to the other end of each duct. 
     
     
       2. An installation according to claim 1, further comprising an internal channel interconnecting said plurality of ducts, said internal channel running through the hot plate parallel to said plane surface and opening onto a side face of the plate. 
     
     
       3. An installation according to claim 2 wherein the vacuum pump is connected to the internal channel at said side face of the plate. 
     
     
       4. An installation according to claim 3 wherein the plurality of ducts comprises a row of ducts disposed transversely to the direction of movement of the endless belt and extending generally perpendicularly to the plane surface between said surface and said internal channel. 
     
     
       5. An installation according to claim 4 comprising additional rows of said ducts spaced from and disposed generally parallel to said row of ducts, and a separate internal channel connected to each row of ducts and opening onto said side face of the plate, the vacuum pump being connected to each channel at said side face.